CHANGWON, KOREA – Hanwha Precision Machinery Co. has changed its name to Hanwha Semitech, accelerating its transition into a comprehensive semiconductor company. The rebranding, announced on Feb. 10, reflects the company's commitment to leading the global market with advanced semiconductor manufacturing solutions, a vision encapsulated in its new name—a blend of "Semiconductor" and "Technology."

Since the 1980s, Hanwha Semitech has been at the forefront of technological innovation, showcasing advanced technologies through surface mount technology (SMT) equipment, semiconductor post-processing equipment, and machine tools. These core technologies have positioned the company as a key player in the electronics manufacturing industry. Last year, Hanwha Semitech expanded its capabilities by acquiring a semiconductor front-end process business, further solidifying its foothold in the semiconductor sector.

The company's current focus is on developing TC bonders, which are essential for manufacturing high-bandwidth memory (HBM), a critical component in AI applications. Additionally, Hanwha Semitech is working on hybrid bonders, a next-generation semiconductor packaging technology. These developments are part of the company's broader strategy to innovate and lead in the semiconductor manufacturing market.

Vice President Kim Dong-seon, the third son of Hanwha Group Chairman Kim Seung-youn, will join Hanwha Semitech as the head of future vision. Known for his role in discovering new business opportunities at Hanwha Vision and Hanwha Robotics, Kim plans to manage without compensation, focusing on investing in new technologies. His involvement is expected to drive the company's expansion into markets centered on cutting-edge equipment like the HBM TC bonder.

"We have embedded our future direction and determination in the new name," Kim stated. He further emphasized the company's commitment to innovation, saying, "We will change the landscape of the semiconductor manufacturing market based on innovative technologies achieved through relentless research and development (R&D) investment."

Hanwha Group, one of South Korea's largest conglomerates, has a diverse portfolio that includes chemicals, materials, finance, construction, and defense. The group's strategic business shifts, including Hanwha Semitech's rebranding, reflect its focus on the burgeoning semiconductor industry. This sector is a critical component of the global technology landscape, driven by the demand for advanced computing, AI, and telecommunications technologies.

CRANSTON, RI – Federal Electronics, a leader in providing advanced electronic manufacturing services, has expanded its Hermosillo, Sonora, Mexico facility from 30,000 sq ft to over 80,000 sq ft to support growing customer demand and further increase vertical integration in the region.

Since its establishment in 2010, Federal Electronics’ Hermosillo facility has been a strategic hub for delivering cost-effective, high-quality solutions to OEMs. The expansion strengthens the company’s ability to serve industrial and medical customers in both the U.S. and Mexico, while employing over 350 skilled professionals dedicated to producing highly engineered high reliability products.

“As our customers’ needs continue to evolve, we continue to expand our capabilities to provide scalable, cost-effective manufacturing solutions without compromising quality,” said Ed Evangelista, President, Federal Electronics. “This expansion in Hermosillo not only increases our production capacity but also enhances our ability to offer integrated, end-to-end solutions for complex electronic assemblies.”

With over 60 years of experience as a U.S.-based company, Federal Electronics seamlessly integrates its Cranston, RI, and Hermosillo, Mexico facilities through a centralized IT and ERP system. This connectivity allows for optimized production, streamlined supply chains, and regulatory compliance, ensuring customers benefit from the efficiency of nearshore manufacturing without sacrificing quality.

For more information on Federal Electronics and its expanded manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com 

At Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.

Solder paste printing is one of the most critical steps in SMT assembly, directly influencing component placement and solder joint integrity. Even slight deviations—such as misalignment, insufficient paste volume, or improper deposition—can compromise product quality and lead to costly rework.

We have integrated a dual inspection system, where post-reflow inspection data provides real-time feedback to the paste printing stage. This closed-loop approach enables immediate process adjustments, reducing errors at the source and maintaining the highest quality standards.

Key advantages for our customers:

Superior product quality – precision-controlled solder paste application results in fewer defects.

Reduced scrap and rework – advanced process control minimises material waste.

Reliable and consistent production – real-time monitoring keeps SMT processes within strict tolerances.

Increased competitiveness in EMS – lower defect rates and optimised efficiency contribute to cost-effective manufacturing.

By investing in advanced inspection technology, Incap Slovakia continues to drive excellence in electronics manufacturing, delivering high-quality, reliable solutions to our customers.

Rancate, Switzerland – Delvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry’s first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.

Horus represents a revolutionary hybrid 3D inspection solution driven by Artificial Intelligence, capable of conducting both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI). Built on proprietary neural networks, it overcomes the limitations of traditional systems, adapting to the diverse variations that arise during production. This advanced technology enables Delvitech to offer an unparalleled inspection solution that integrates effortlessly into every aspect of Surface Mount Technology (SMT) production, redefining inspection processes with unmatched precision and efficiency.

Key Features of the Horus System:

· Unified Recipe Import: The system imports a comprehensive inspection recipe encompassing all production processes.

· User-Friendly Interface: Features dedicated tabs for PASTE, PLACEMENT, and REFLOW, each displaying relevant data for streamlined inspections.

· Advanced Inspection Capabilities: Offers specialized inspection steps within each process.

· Defect Visualization: Detected paste defects are displayed in the Verification Station interface together with components defects, for thorough analysis.

Delvitech’s proprietary neural network technology minimizes manual configuration by independently identifying and defining PCB components with exceptional accuracy. This approach reduces false positives and ensures unmatched precision across various PCB types and production stages.