Press Releases
SAN JOSE, Calif., March 2025 – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, appoints Freddie W. Chavez Jr. as Vice President of Business Development. Freddie brings over 20 years of experience in sales and business development, including roles in general management and operations.
In his new role, Freddie will drive Naprotek’s top-line growth by leveraging the company’s unique offering of mission-critical electronic components and assembly services. He will work closely with the executive leadership team to formulate and execute growth strategies that promote its East Coast center of excellence in RF components, micro-e assembly, and fabrication services including wafer dicing, lithography, and thin film circuits, along with our West Coast center of excellence in high-mix, high-complexity PCB assembly, integration, and testing.
Freddie recently served as Director of Corporate Business Development at Stellant Systems and as Senior Vice President at Frontgrade Aethercomm Inc.
Additionally, Freddie has a distinguished military career, having served in the United States Marine Corps for nearly five years. He is a Desert Storm veteran and has received the Navy Achievement Medal and the title of Southwest Asia Marine of the Year.
“We are excited to welcome Freddie to Naprotek,” said Teh-Kuang Lung, President and CEO of Naprotek. “His deep experience in RF technology, strategic customer interface, and leadership in business development will be crucial in advancing our growth across the enterprise. We look forward to the innovative strategies and leadership he will bring to our organization.”
“I am thrilled to join Naprotek and contribute to its continued success,” said Freddie Chavez. “I look forward to working with the talented team at Naprotek to drive growth and deliver exceptional value to our customers.”
For more information about Naprotek and its high-reliability manufacturing services, please visit www.naprotek.com or contact our support team.
About Naprotek
Naprotek is an electronics technology solutions provider for high-reliability applications. Since 1995, Naprotek has delivered complex and custom solutions in the Defense, Space, Medical, and Semiconductor Capital Equipment markets and select applications in Test & Instrumentation and Advanced Technology. Capabilities include quick turn printed circuit board assembly, prototyping, RF components, advanced microelectronics, system integration, and test services. Naprotek is committed to delivering customer value through engineering, supply chain management, and manufacturing support. To learn more visit www.Naprotek.com.
HILLSBORO, OR – The Northwest Electronics Design & Manufacturing Expo (NEDME) is gearing up for its 2025 event, and exhibitor registration is now open! Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This year’s keynote speaker is Quantum Computing hardware expert Jim Clarke.
Going 22 years strong, NEDME remains the Pacific Northwest’s premier trade show for electronics design and manufacturing professionals.
Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now.
Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics and manufacturing sector.
In addition to exhibitor registration, NEDME is accepting applications for breakout speaking sessions. Industry experts and thought leaders are encouraged to apply to present engaging, educational sessions on cutting-edge topics in electronics design, manufacturing and more.
Be a part of the Pacific Northwest’s top electronics industry event!
• Exhibitor Registration & Booth Reservations: Register online at www.nedme.com
• Speaker Applications: Submit proposals at www.nedme.com
• Event Date: Wednesday, October 22, 2025
• Location: Wingspan Event & Conference Center, Hillsboro, OR
If you have questions or need more details – email board@nedme.com.
As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Tuesday, March 18
Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.
This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.
Wednesday, March 19
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.
This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.
This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.
This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).
Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jarrett.
This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.
To learn more about Indium Corporation’s solder and TIMs solutions, visit www.indium.com or visit with our experts at APEX 2025 in booth #1416.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
Tyngsboro, Massachusetts, USA, February 20, 2025—
Transition Automation, Inc. (TA) is exhibiting a full product range of Permalex Edge Metal Squeegees and Holder systems at this year’s IPC-Apex trade show. The expanding range includes two variations of holders, the Standard “32”, and the Slim-Line 38 – magnetic tool free holder. Additionally, Transition has introduced a new line of Poly-Max polyurethane holder systems for any SMT platform. Transition will exhibit at booth number 2313.
Transition Automation, Inc. was founded in 1989 and is the first company to develop polymer infused metal squeegees for SMT, when all SMT printers at the time used Polyurethane blades. Transition Automation remains the only company with a singular focus on High Performance Metal Squeegee blades and holder systems. Permalex brand squeegees are used by many top tier electronics manufacturers – especially those companies who supply to high value, mission critical end-markets, such as Space and Satellite, Automotive, Avionics and Industrial Controls. Transition Automation, Inc. is located at 5 Trader Circle, Building D, Tyngsboro, Ma 01879 USA . Phone: 978-649-2400; Web: www.metalsqueegees.com, email: sales@transitionautomation.com
March 6, 2025
ROME, NY USA – EOS/ESD Association Services, LLC is proud to announce a strategic partnership with SRF Technologies, bringing together expertise to deliver comprehensive ESD and EOS diagnostic and resolution services. This collaboration provides testing, consulting, and complete ESD/EOS solutions for industries worldwide.
Providing Unmatched ESD/EOS Diagnosis & Resolution Services. Our Services Include:
✔ Diagnosis of ESD and Latch-Up Failures – Specialized support for HBM, CDM, and IEC test diagnostics.
✔ Product Failure Analysis – In-depth analysis to identify and address ESD-related failures.
✔ ESD & Latch-Up Design Corrections – Expert assistance in correcting design-related ESD/Latch-Up failures.
✔ Electrical Overstress (EOS) Damage Diagnosis – Identification of EOS damage sources and implementation of effective mitigation techniques.
With the combined expertise of EOS/ESD Association Services, LLC and SRF Technologies, clients can expect state-of-the-art solutions that ensure product reliability, compliance, and protection against electrostatic and electrical overstress challenges.
In a joint statement, Lisa Pimpinella, Sr. Executive Director, EOS/ESD Association, Inc. & Stephen Fairbanks, President, SRF Technologies said, "This partnership between EOS/ESD Association Services, LLC and SRF Technologies represents a significant path forward providing industries with the highest level of expertise in ESD and EOS diagnostics, mitigation, and prevention. By combining our resources, knowledge, and experience, we are committed to delivering innovative, reliable, and effective solutions to ensure product integrity and compliance you can trust.”
Contact EOS/ESD Association Services, LLC today to arrange a quote and take the next step in securing your ESD/EOS reliability! SRF Technologies has been providing independent ESD and EOS Consulting for both design, test and diagnostics in the semiconductor industry for nearly 20 years. Their expertise has spanned the CMOS and BiCMOS technologies in all industries and all process nodes. More information can be found here: www.srftechnologies.com
EOS/ESD Association Services, LLC is focused on providing services as an extension of its parent organization, EOS/ESD Association, Inc. EOS/ESD Association Services, LLC executes parts of the Association mission to provide education and training to control and prevent static discharge. EOS/ESD Association, Inc. volunteers, who are experts in their fields and participants of EOS/ESD Association, Inc. standard committees, provide their time and efforts to EOS/ESD Association Services, LLC. www.esda.org/srfesdallc
March 7, 2025 -- Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Dallas Expo & Tech Forum taking place on April 1 at the Plano Event Center in Plano, Texas. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings.
In celebration of emerging trends in electronics miniaturization, AIM is declaring 2025 the “Year of Type 5”. With decades of experience producing high-quality solder pastes, including Types 4, 5, and 6, AIM is uniquely positioned to guide customers through the transition to finer powders. AIM products are developed with a focus on consistency, reliability, and process optimization, and are then coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating, driven by demand for precise, consistent soldering.
To learn more about AIM’s solder paste offerings and to discover all of AIM’s products and services, visit the company at the SMTA Dallas Expo & Tech Forum on April 1st, or visit www.aimsolder.com.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.
