Press Releases
NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce its participation in SMTconnect 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. The company will exhibit its latest innovations in reflow technology at the booths of its manufacturers' representatives, ANS answer elektronik Service- & Vertriebs GmbH and Stratus Vision GmbH.
ANS, located at Hall 4, Booths 245-345, and Stratus Vision, located in Hall 4 Booth 247, will host BTU International's advanced reflow solutions. BTU will feature its Pyramax 100A unit in the ANS booth and the Aqua Scrub™ Flux Management unit in the Stratus booth, offering attendees firsthand experience with state-of-the-art thermal processing equipment.
The Pyramax 100A reflow oven integrates advanced features, including closed-loop convection control and the Wincon oven control system, to deliver superior performance and reliability within a compact footprint. Designed to meet the evolving demands of modern electronics manufacturing, the Pyramax 100A ensures precise temperature control and uniform heating for optimal soldering results.
In the Stratus Vision booth, BTU International will highlight its Aqua Scrub™ Flux Management Technology. This next-generation solder reflow flux management system is engineered to significantly reduce operational costs compared to traditional condensation systems. Aqua Scrub's patent-pending design utilizes aqueous-based scrubber technology compatible with a wide range of paste and flux types, offering enhanced efficiency and productivity while drastically lowering scheduled downtime. The Aqua Scrub flux management system is designed within the new Aurora platform of reflow ovens and can also be retrofitted to current Pyramax units.
Company representatives will discuss how the new Aurora platform is guiding the way to the lights out Industry 4.0 factory of the future by seeing reflow in a new light. Implementing the industry’s first factory configurable heating and cooling zones provides the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling constraints, or increased throughput requirements.
For a hands-on view of the BTU equipment and its portfolio of thermal processing solutions, please visit ANS at Hall 4, Booth 245-345 and Stratus Vision at Hall 4, Booth 247 at SMTconnect 2024.
To learn more visit www.btu.com
SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation at the upcoming SMTconnect exhibition, taking place June 11-13, 2024 in Nuremberg, Germany.
Find KIC at the SmartRep booth 4A.225 where the company will showcase its latest innovation, Contact-less Thermal Analysis™. This groundbreaking technology enables real-time monitoring of temperature and convection changes by directly measuring board temperatures during production. With Contact-less Thermal Analysis™, manufacturers can achieve unmatched accuracy in reflow profiles, ensuring optimal quality and reliability in the production process.
Moreover, KIC will introduce its new profiling software platform, the Thermal Analysis System, featuring the addition of a cutting-edge recipe optimization search mode called Common Recipe Finder™. The Thermal Analysis System software offers a state-of-the-art User Interface, providing flexibility in reflow and wave recipe setup with a user experience akin to browsing. Common Recipe Finder™ simplifies changeover time by identifying a single recipe for multiple assemblies, thereby enhancing equipment utilization and Overall Equipment Effectiveness (OEE).
"We are excited to unveil our latest innovations at SMTconnect 2024," said Miles Moreau, General Manager at KIC. "With Contact-less Thermal Analysis™ and Common Recipe Finder™, we continue to push the boundaries of thermal process control, empowering manufacturers to achieve unprecedented levels of precision and efficiency in their production processes."
Visit KIC at the SmartRep booth 4A.225 during SMTconnect 2024 to experience its Contact-less Thermal Analysis™ and Common Recipe Finder™.
Learn more about KIC's Contact-less Thermal Analysis TM and Convection Detection at www.kicthermal.com/reflowheattransfer
For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com
INGLESIDE, IL – IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will highlight its automation capabilities and PCB labeling solutions at PCB East, June 4-7 in Boxborough, MA, Booth #301.
With automation a key theme, IDENTCO’s commitment to simplifying the automation process for PCB manufacturers is evident through the company’s comprehensive label and equipment packages. Designed for hassle-free integration, IDENTCO’s automation products offer plug-and-play functionality with most SMT equipment brands.
Attendees of the show will have the opportunity for a live demonstration of the IPS-30 Slimline Label Feeder. At a mere 30mm (1.18 in.) wide – half the size of conventional feeders – the IPS-30 requires only one feeder position on pick and place machines, freeing up valuable space along congested SMT production lines. Providing precise and accurate placement, it can also feed labels or die cut parts as small as 2mm x 2mm.
Additionally, IDENTCO offers the IPS-45, a presenter ideal for applications requiring a wider variety in label size.
The company will also be exhibiting their robust label solutions for printed circuit board (PCB) applications, including DuraTrack. This label series provides printed circuit assemblies with comprehensive traceability – an increasingly attractive internal quality control and supply chain transparency feature for brand owners producing high-leverage electronics.
Engineered for use in surface mount technology and throughout the entire assembly process, DuraTrack thermal transfer printable labels can endure harsh fluxes, the latest cleaning chemistries, and high temperatures encountered in today’s circuit board assembly processes, on both sides of the board.
BESIGHEIM, GERMANY – Weller Tools, a leader in hand soldering solutions, is proud to announce its participation in the upcoming SMTconnect exhibition, scheduled to take place from June 11-13, 2024 in Nuremberg, Germany. Under the theme #PowerfulTogether, Weller emphasizes the collective strength formed when individuals and tools unite seamlessly to achieve remarkable results.
Weller Tools will showcase together with its rep Hörl Industrievertretungen a range of innovative products and solutions designed to enhance productivity, precision and performance in soldering applications. Among the highlights stealing the spotlight are the WXsmart Soldering Station and the ZeroSmog Shield Pro Fume Extraction system.
WXsmart Soldering Station - Redefining Hand Soldering:
The WXsmart Soldering Station represents a new era in hand soldering technology. This innovative platform offers a comprehensive solution catering to all soldering application needs. With the ability to connect up to 16 different tools, the WXsmart Station accommodates component sizes from 0402 to 1612 and beyond, streamlining operations and boosting productivity. Its seamless incorporation of the WXair Rework Module expands capabilities to cover soldering, desoldering, and rework applications.
Focus on Active RT Soldering Tips:
Weller Tools showcases its Active RT soldering tips, fully compliant with IPC industry standards. The boomerang handle design, ergonomic grip, and quick, toolless tip changes make the extended RT series an ideal choice for precision work on components of all sizes.
ZeroSmog Shield Pro Fume Extraction - Ensuring Impeccable Air Quality:
Weller presents the ZeroSmog Shield Pro, a state-of-the-art solder fume filtration system revolutionizing individual workstations. This system ensures impeccable air quality by capturing solder particles and gases, providing a healthier working environment. Its compact and stackable design maximizes workspace, and features like work zone identification and filter condition monitoring enhance the overall user experience.
Visit Weller Tools at Booth Hall 4-221 (Hörl Industrievertretungen) at SMTconnect 2024 to experience the collective strength of soldering solutions. Join the #PowerfulTogether movement and unlock new possibilities in soldering excellence.
To learn more, visit www.weller-tools.com
SEOUL, KOREA – PEMTRON EUROPE, an inspection equipment developer and supplier, is pleased to announce its participation in the upcoming SMTconnect, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. See the invisible world in Hall 4A, Stand 245 – Visitors can expect to see PEMTRON's latest advancements in inspection systems, including the Saturn 3D Inline Solder Paste Inspection System, Athena TPI Press-fit 3D Automated Optical Inspection System, TWIN Top/Bottom Double Sided Simultaneous 3D Automated Optical Inspection System, and TROI 8800 CI Series Conformal Coating Inspection System.
Saturn 3D Inline Solder Paste Inspection (SPI) System:
PEMTRON's Saturn 3D SPI System features Moiré technology, combining 2D color images with 3D measurement data for unparalleled accuracy and realism. Unlike conventional methods, which rely solely on color maps, the Saturn system provides more accurate 3D inspection images. With quad projection, 10/15 or 18um resolution, and an optional 4MP (or 10MP) camera, along with a three-stage conveyor (with optional rail extensions), the Saturn is the most advanced 3D SPI system.
Athena TPI Press-fit 3D Automated Optical Inspection (AOI) System:
The Athena TPI system is tailored for Tall Part Inspection, leveraging a specially developed projector for optimal performance. This advanced system delivers high-speed and high-accuracy inspection capabilities, particularly crucial for industries necessitating precise measurements, such as press- fit components, housing pins, and shielding cases. With robust software adept at handling diverse statistical process data, the Athena TPI system facilitates increased production yield rates, real-time process monitoring, defect root cause identification, cost reduction, and enhanced product quality assurance.
TWIN Top/Bottom Double Sided Simultaneous 3D Automated Optical Inspection System:
PEMTRON will also showcase the TWIN 3D AOI system, designed for top/bottom double-sided simultaneous inspection, enhancing both space utilization and inspection efficiency. The system features an upgraded head type for 3D formation identical to the real image, ensuring stability and accuracy in inspection processes.
TROI 8800 CI Series Conformal Coating Inspection System:
The TROI 8800 CI Series Conformal Coating Inspection System, equipped with optional inline Coating Thickness Measure, offers reliable conformal coating inspection. With intuitive programming capabilities, the system can detect defects such as cracks, coating voids, and incorrect coating thickness (too-thin or too-thick) with precision and efficiency.
For more information about PEMTRON, visit https://pemtron.com/
CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.
Tuesday, June 11
- Moving to Pb-Free for Power Discrete Die-Attach by Product Manager – Semiconductor Dean Payne
- Pb-based solder has been the standard material for power discrete die-attach for decades. This session will focus on the various Pb-free alternatives, their pros and cons, and the challenges faced when switching from Pb-based solder to Pb-free solder.
Wednesday, June 12
- Solder Material Optimization that Enables Reliable Power Module Heat Dissipation by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
- As power densities continue to increase for power module devices, there is a corresponding need for improved thermal management. This presentation will explore thermal interface and soldering material technologies that can be leveraged for improved thermal performance and extended lifecycle reliability in these applications.
- The presentation will be given in German.
- Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
- This presentation will explore the design criteria for materials selection in SiC molded package-attached applications, balancing cost, performance, and manufacturability. An emerging solder alloy technology will be highlighted, which can mitigate package warpage and delamination in the package and enable soldering as a thermal interface material in these applications.
- Solder Preform Technology for Improved Thermomechanical Performance in Molded Power Module Package-Attach poster session by Hertline This SAC-In alloy technology reduces peak temperatures, removing the risk of delamination with molded package power modules. This Bi-free alloy provides favorable mechanical properties to achieve reliability performance comparable to SnSb5 for thermal shock testing -40°C/125°C.
All presentations will be given in English unless otherwise noted.
Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his innovative LED automotive lighting patent as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
Joe is responsible for driving the power electronics product line’s growth by developing and implementing marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit our experts at PCIM in hall 6, stand #466.
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- AIM to Present on Micro/MiniLED Applications and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Guadalajara Expo & Tech Forum