BLAUBEUREN, GERMANY – Bondexpo, one of the most important international trade fairs for industrial bonding technologies, is opening its doors in Stuttgart for the 17th time: from 8 to 11 October, numerous exhibitors will be presenting their detail and system solutions for joining and connecting components and assemblies in pre-assembly and final assembly – Rehm Thermal Systems will also be there with its dispensing and conformal coating system!

In Hall 5 at Booth 5411, the Rehm experts will inform you about the wide range of applications of the ProtectoXP as well as the new integrated 3D height sensor of this dispensing and coating system and will be happy to answer all your questions.

The system impresses with its process reliability, solid mechanical engineering and versatile applicators, which allow the user a wide range of possible applications: in addition to dispensing, the ProtectoX series amazes with the ability to create freely defined three-dimensional enclosure shapes through simple application. Immediate curing of UV coatings is possible with ProtectoX systems as well as moulding or bonding of different materials.

The series operates through the intuitive ViCON Protecto software, which is particularly user-friendly thanks to a newly developed touchscreen interface. It features numerous software capabilities, including the ability to directly import eCAD data and image files for optimizing the coating process through trimming. Furthermore, coating programmes can be created directly on the machine or at an offline workstation.

We look forward to your visit and the opportunity to discuss the individual challenges of your manufacturing or production with you in person: we will find the right solution for you – in keeping with the tradition of the state of inventors and tinkerers!

ZION, IL – Stannol, a leader in soldering technology, is excited to announce its participation in SMTA Guadalajara 2024, taking place from Sept. 11-12, 2024 at the Expo Guadalajara, Jalisco (Mexico). Stannol will showcase its cutting-edge products at Booth 502, in collaboration with its distributor, Quiptech Mexico.

Highlighting Stannol's Advanced Products:

New Water-Based Cleaning Line
Stannol is proud to introduce its new water-based cleaning line, designed to meet the rigorous demands of modern manufacturing while prioritizing environmental compatibility. The new Flux-Ex series includes broadband and specialty cleaners that are perfectly tailored to their respective areas of application – e.g. for cleaning before the soldering process or for removing residues after soldering. All cleaners are delivered as a ready-to-use-mix.

Solder Wire: Kristall 600-Series, Flowtin, and Fairtin
Stannol’s Kristall 600-Series and Flowtin and Fairtin solder wires represent significant advancements in soldering technology. The Flowtin series leverages innovative micro-additives to extend solder tip life by up to 30%, enhancing the quality and durability of solder joints. The Kristall 600-Series, including the Fairtin product line, combines synthetic resins and modern activators to ensure fast, safe wetting with minimal, transparent residues.

Solder Paste: SP6000
The SP6000 solder paste, developed for use with TSC305 (Sn96.5Ag3Cu0.5) T4 and TSC105 (Sn98.5Ag1Cu0.5) T4 alloys, is a testament to Stannol’s commitment to technical excellence and environmental responsibility. This innovative paste boasts an impressive reduction of CO2 emissions by over 85% compared to traditional solder pastes, achieved through the use of recycled solder, sustainable packaging materials, and climate-neutral transport. The SP6000 not only delivers superior performance but also aligns with Stannol’s sustainability goals.

Stannol invites all attendees to visit them at Quiptech Mexico's booth (502) to learn more about these cutting-edge products. Live demonstrations and technical discussions will provide insight into how Stannol’s solutions can enhance manufacturing processes and contribute to a more sustainable future.

For more information, visit www.stannol.com 

CAMBRIDGE, UK – Photonic Integrated Circuits (PICs) are photonic circuits formed on a semiconductor material that allows light to pass through it, such as silicon dioxide, also known as Silica (or Glass). These photonic circuits contain components for manipulating light passing through the circuit, enabling functionalities such as data transmission, sensing, and processing within a compact form factor.

PICs are fundamentally altering how we manage and utilize optical signals, paving the way for advancements across multiple industries. IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, explores key market players, emerging materials like TFLN and BTO, and new applications such as AI to forecast the future growth of the PIC market.

PICs offer substantial advantages over electronic ICs due to their fundamental properties. Light, which travels approximately three times faster than electricity, can transmit data with significantly higher efficiency. In materials such as Silicon Nitride or Indium Phosphide, specific frequencies of light (like 1550nm) experience much lower propagation losses compared to electrical signals. These attributes allow photonic waveguides to achieve up to ten times better data transfer efficiency, one hundred times higher bandwidth, and much shorter latency (0.3 times) when compared to their electronic counterparts. Furthermore, Silicon Photonics—a subset of PIC technology—is essential for reducing energy consumption during data transmission, as noted by C.C. Wei, president of TSMC. Additionally, PICs can be integrated into modern CMOS processes and are relatively easy to combine with existing electronic systems, enhancing their versatility and effectiveness in advancing data communication technology.

Given their benefits, PICs find applications in a diverse range of fields. In telecommunications, they enable high-speed data transfer, supporting the burgeoning demands of the internet and communication networks. Environmental sensing is another area where PICs shine, with applications such as artificial noses that detect various compounds and molecules in the air, while the healthcare sector benefits from PIC technology through enhanced diagnostic tools and medical devices. IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, highlights that photonic transceivers for AI are poised to become the largest demand source for PICs. The increasing need for high-speed, efficient data processing in AI applications fuels this growth. Additionally, emerging technologies such as programmable photonics, photonic quantum computers, and co-packaged optics are set to redefine the capabilities and applications of PICs, unlocking new potentials in computing, communication, and sensing technologies.

Despite these advantages, the PIC market faces several challenges. Cost management also poses a critical issue, as designing and manufacturing PICs involves substantial initial investments. Large demand volumes are necessary to offset these expenses, and production lead times can extend over several months, complicating market responsiveness.

Material limitations further complicate the development and performance of PICs. While silicon and silica are common in current PICs, they are not the most efficient materials for light sources or photodetectors. This necessitates the combination of silicon with III-V materials; however, this brings another challenge to the table – integration complexity. Combining different materials and components into a single PIC requires intricate engineering and manufacturing processes, ensuring compatibility and consistent performance across the various materials.

Addressing material challenges is crucial for advancing PIC technology and expanding its use across different applications. Therefore, the future of PICs depends on exploring and adopting new materials to overcome these limitations. While silicon remains dominant, several emerging materials are gaining traction. Thin Film Lithium Niobate (TFLN) offers moderate Pockels effect and low material loss, making it ideal for high-performance modulation applications, including quantum systems and future high-performance transceivers. Monolithic Indium Phosphide (InP) continues to be significant due to its ability to detect and emit light, though it faces challenges related to high losses and costs. Barium Titanite (BTO), known for its superior modulation performance, is anticipated to find applications in quantum photonic systems where modulation efficiency is paramount. Silicon Nitride (SiN) provides lower losses compared to other materials but comes with higher costs and larger device sizes due to its low refractive index, limiting its current widespread adoption. According to IDTechEx’s analysis, silicon is expected to remain the dominant material in the PICs market. However, in the long run, monolithic Indium Phosphide (InP) and Thin-Film Lithium Niobate (TFLN) are projected to gain a growing market share.

In conclusion, PICs are driving significant advancements across various domains. Despite challenges related to integration complexity, cost management, production lead times, and material limitations, the ongoing exploration of new materials and emerging technologies promises a bright future for PICs.

IDTechEx's report, “Silicon Photonics and Photonic Integrated Circuits 2024-2034: Market, Technologies, and Forecasts”, examines key market players, emerging materials like TFLN and BTO, and new applications such as AI to project the growth of the Silicon Photonics and Photonic Integrated Circuit (PIC) market. The report also explores emerging technologies, including Programmable Photonics, Photonic Quantum Computers, and Co-Packaged Optics.

TYNGSBORO, MA – Transition Automation, Inc. is pleased to announce that it will showcase advanced SMT squeegees at the upcoming SMTA show in Guadalajara, Mexico this coming September.

High on the list of items being displayed is the third generation of Soft-Touch Articulating Paste Retainers, which give SMT Printing Professionals enhanced performance and protection of their stencils during printing. The lineup will includes the company’s unique EZ-Clean Frame System, which is a dual storage and carrier system to help maintain clean squeegees free from damage during handling, cleaning and storage. Transition will occupy Stand #211 during this event and will be supported by its long term distributor Seltek International.

Transition Automation, Inc. is a worldwide leader in the manufacturing and sales of Permalex® Edge Metal Squeegees, holder systems, and advanced SMT printing systems. Founded in 1989, Transition Automation, Inc. was the first company to develop polymer- infused metal squeegees for SMT when all printers at the time used urethane squeegees. Transition Automation remains the only company with a singular focus on high-performance Metal Squeegee blades and holder systems. Permalex brand squeegees are used by many top-tier electronics manufacturers – especially those companies who have high value, mission critical end-markets, such as space and satellite, automotive, avionics and industrial controls. The company is located at 5 Trader Circle, Building D, Tyngsboro, Ma 01879 USA; Phone: 978-649-2400; Fax 978-649-2402, Web: www.metalsqueegees.com