CLINTON, NY – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.

Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s newest jetting solder paste, PicoShot® NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot, with a minimum dot size of 230um. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

NC-809 is a halogen-free, ultra-low residue flip-chip flux engineered with high-tack characteristics and designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps, which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.

Indium Corporation is also proud to feature its innovative Durafuse® solder technology:

Award-winning Durafuse® LT – a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. Durafuse® HR – based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications.

Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature, lead-free (HTLF) paste, presenting the merits of both constituent alloys.

Additionally, Indium Corporation will feature QuickSinter®, a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput, with both silver and copper sinter pastes available.

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #727 at ECTC or online at indium.com/HIA.

DONCASTER, UK – SMTXTRA, a renowned leader in Surface Mount Technology (SMT) equipment services, is proud to announce the appointment of E-Tronix, a Stromberg Company, as its Manufacturers’ Representative for key territories across the United States.

E-Tronix specializes in serving the electronics assembly, medical device manufacturing, semiconductor manufacturing, and research and development industries. With a territory encompassing Minnesota, North Dakota, South Dakota, Iowa and Nebraska., E-Tronix brings extensive expertise and industry knowledge to its role as a representative for SMTXTRA.

As a trusted Manufacturers’ Representative company, E-Tronix is committed to providing exceptional service and support to customers in the specified territories. With a focus on electronics manufacturing and related industries, E-Tronix offers comprehensive solutions tailored to meet the diverse needs of its clientele.

"SMTXTRA is pleased to partner with E-Tronix as our representative for this important territory," said Tony Longo, Director of Sales at SMTXtra USA. "Their extensive experience and dedication to customer service make them an ideal partner to promote and support our range of SMT parts, equipment and services."

SMTXTRA offers a full range of SMT parts, equipment, and services designed to meet the diverse needs of electronics manufacturers. From feeder repair and testing services with a substantial 3- month warranty to calibration services for various SMT equipment brands, SMTXTRA ensures unmatched quality and reliability in every aspect of its offerings.

For more information about E-Tronix, visit http://www.e-tronix.com 

To learn more about SMTXTRA and its range of services, visit www.smtxtra.com 

REDDITCH, UK – Altus Group, a leading supplier of capital equipment for the electronics manufacturing industry, has announced the successful installation of an advanced PCBA cleaning system at Surrey Satellite Technology Limited (SSTL). The Kolb PSE LH5 will optimise SSTL's critical cleaning processes for their sophisticated electronics applications.

SSTL is renowned for delivering complete mission solutions and is at the forefront of space innovation. Their customised systems for earth observation, science, communications, navigation, in-orbit debris removal and servicing, requires electronics of the highest quality and reliability. As a result, SSTL's production processes must meet exceedingly stringent standards, which includes their electronics cleaning processes.

Altus has a long-standing partnership with SSTL, having previously supplied them with cleaning equipment. As SSTL sought to modernise and optimise its PCBA cleaning process for its critical space and satellite applications, they selected Kolb's industry-leading PSE LH5 system as the ideal solution.

Joe Booth, CEO of Altus Group said: "We have seen a number of Kolb cleaning projects come through in 2023 and even the start of 2024, but being able to secure a partnership with a world-class company like SSTL is particularly significant. SSTL is truly a jewel of UK electronics manufacturing. The nature of their products demands production quality at the highest possible level, so being selected by them to enhance their production process shows the confidence and technical value they place in Kolb's cleaning solutions and in Altus as a trusted supplier."

The Kolb PSE LH5 boasts unique features and advanced engineering, setting it apart as a top-tier solution for precision cleaning in electronics manufacturing. Manufactured entirely in Germany, Kolb's expertise spans chemistry and cleaning systems, ensuring a comprehensive understanding of the cleaning process. The PSE LH5 offers a highly capable cleaning process tailored for products with smaller board sizes, making it an ideal choice for SSTL's exacting requirements.

Adam Chudziak from SSTL said: "The quality and reliability of our satellite electronics are absolutely critical to mission success. After a comprehensive evaluation, the Kolb PSE LH5 system supplied by Altus Group was the clear choice to modernise our PCBA cleaning capabilities. We have full confidence it will enable us to uphold and enhance our meticulous cleaning processes moving forward."

This fully automatic economy batch cleaner is designed to deliver exceptional cleaning performance for assembled PCBs. With a high-capacity cleaning cycle, the PSE LH5 thoroughly removes misprints from reflow flux residues, resin, copper, oxide, and soldering support substances. Its innovative features, including a two-tank system with triple-circuit function, automatic monitoring of ionic residues, and high-resolution display for software control, guarantee efficient and reliable cleaning processes.

MORRISVILLE, NC – The Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O’Malley Chief Technical Officer (CTO).

As CTO, Grace will take a more strategic role in shaping iNEMI’s technology vision. She will continue to work with iNEMI’s Technical and Research committees and will provide oversight between roadmapping and project activities to ensure alignment with industry needs. She will also interface with member companies to identify the critical areas where iNEMI should focus efforts to drive innovation, ensuring the consortium’s technical activities align with and support members’ business goals.

“Grace’s professionalism, expertise, and passion for excellence make her a perfect fit for this crucial role in our organization,” said iNEMI CEO Shekhar Chandrashekhar. “Grace has been a valuable member of our team since joining iNEMI, consistently demonstrating exceptional leadership, strategic thinking, and a deep understanding of our technological landscape. She has played a pivotal role in supporting technology implementations in our member companies, and in spearheading key projects and fostering collaboration across the electronics manufacturing value chain.”

Grace joined iNEMI in 2007 as iNEMI was building its presence in Europe. She was named Vice President of Global Operation in 2014, and later became Vice President of Technology and Project Operations.

Prior to iNEMI, Grace worked for Motorola in the U.S. on the development and deployment of flip chip capabilities and low-cost assembly processes. She also led a multidisciplinary research team at Motorola’s site in Jaguariuna, Brazil. Grace started her career focused on electronics packaging and board assembly at the Tyndall National Institute (Cork, Ireland).

Grace holds eight U.S. patents. She is currently on the IEEE EPS Board of Governors as a member-at-large for Region 8 (2023-2025) and also served in that capacity for 2018-2020. Grace has an honours bachelor’s degree in electrical engineering from University College Cork (Ireland), and a Master of Science in Materials and Manufacturing Engineering from the Illinois Institute of Technology (Chicago). Grace is based in Limerick, Ireland.