NASHVILLE – Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will present the technical paper “Methods used to Qualify Soldering and Cleaning Materials and Processes” on Tuesday, March 18 at the 2025 IPC APEX EXPO Technical Conference.

Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean flux residues, partially cleaned flux residues, and wash fluids not fully rinsed during cleaning. These contaminants interact with their environment leading to the deterioration of components, ultimately causing system malfunctions.

Testing methodologies, such as Surface Insulation Resistance (SIR), Ion Chromatography (IC), and C3 testing, are designed to identify potential failure points and ensure electronic systems can withstand the challenges of different environments. Bixenman’s research paper will provide insight into the effects of process contamination and the use of these methods to qualify the assembly process.

Bixenman’s presentation, “Methods used to Qualify Soldering and Cleaning Materials and Processes” will be one of four presentations during the “Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness” session.

Additional presentations during the session are: “From the Corrosion to Short Circuiting in Electronics: Investigation of The Detrimental Dendrite Development” presented by Dr. Kapil Kumar Gupta of Technical University of Denmark, “Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness” presented by Dr. Rajan Ambat of Technical University of Denmark, and “Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics” presented by Dr. Anish Rao Lakkaraju of the Center for Electronic Corrosion (CELCORR).

For more information about the technical conference or to register to attend, visit the official website of IPC APEX 2025. For more information about Magnalytix, click here.

CHELMSFORD, MA – VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced plans to exhibit at the 2025 IPC APEX EXPO, taking place March 18-20, 2025 at the Anaheim Convention Center. At Booth #2513, attendees will experience firsthand the Summit 2200i Rework System, XQuik III Component Counter, and Apogee 130 X-ray Inspection System, each designed to enhance precision, automation, and efficiency in electronics manufacturing.

Summit 2200i: Precision and Automation Unleashed

The Summit 2200i is a state-of-the-art, fully automatic rework system designed for medium to large-sized Surface Mount Device (SMD) assemblies. With the capability to handle boards up to 22” x 30” and components as small as 01005, the Summit 2200i sets a new industry standard in precision and automation. Key features include:

• Automatic alignment for components up to 100mm square, reducing operator intervention.
• Advanced thermal control for optimal soldering and rework precision.
• Enhanced process automation, minimizing manual handling and improving repeatability.

The Summit 2200i is built to address the increasing demand for high-precision, hands-free rework solutions, making it an essential tool for modern electronics assembly processes.

Apogee 130: High-Resolution X-ray Inspection at an Affordable Price

The Apogee 130 delivers superior 2D & 2.5D X-ray imaging for a variety of applications, including PCBs, electrical components, medical devices, counterfeit component screening, and wire harness inspections. Key advantages include:

• High-clarity imaging with advanced defect detection for BGA, QFN, PTH, and solder voids.
• New Vi5 software integration, featuring real-time visualization, auto contrast, and advanced defect enhancement tools.
• User-friendly GUI for intuitive operation, reducing training time and increasing efficiency.

With maintenance-free X-ray components and a long service life, the Apogee 130 provides high-resolution, automated X-ray inspection at a cost-effective price point, making it a valuable addition to production and quality control environments.

XQuik III: The Smart Factory Component Counter

The XQuik III is a fast, accurate, and intelligent X-ray counting system engineered for modern electronics manufacturing. With a cycle time of less than 10 seconds, the XQuik III eliminates the inefficiencies of slow, manual inventory counting—an issue made even more critical amid ongoing component shortages that can lead to line-down situations. Key benefits of the XQuik III include:

• Industry-leading count accuracy of over 99.8% using AI-driven automatic component recognition.
• Fast cycle times: Counts both a large reel and four small reels in under 10 seconds, including automatic barcode scanning.
• Push-to-start operator experience for simple, efficient use.
• Flexible MES interface for seamless communication with any inventory control system.
• Pass-through automation capability for smart factory integration.

VJ Electronix invites attendees to visit Booth #2513 at the 2025 IPC APEX EXPO to explore how these cutting-edge solutions can enhance precision, efficiency, and automation in electronics manufacturing. For more information or to schedule a demo, visit www.vjelectronix.com 

TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host an insightful webinar titled "Importance of Mechanical Stress Measurement for PCB Assembly and Mounting Process" on Wednesday, March 5, 2025 at 1:00 PM EST. The event will be presented by James Hara of Kyowa Americas, an expert in strain gage measurement and the effects of mechanical stress on PCB assembly processes.

Registration is now open! Join us for this informative session by registering here: Webinar Registration Link.

This webinar is part of Seika Machinery’s ongoing Seika Webinar Series, in collaboration with Kyowa Americas, and is designed to provide valuable insights into the critical role of mechanical stress evaluation in ensuring the durability and reliability of printed circuit boards (PCBs).

PCBs used in automotive, commercial vehicle, and consumer electronics applications are exposed to harsh environments that can affect their long-term reliability. Even the smallest crack in a PCB can lead to catastrophic system failure, making it essential for manufacturers to assess and mitigate mechanical stress and strain during the design and assembly processes.

James Hara will discuss the importance of evaluating mechanical strain in PCBs and provide an overview of strain gage methodology. This approach helps identify areas of high stress concentration, which can potentially lead to board breakage or failure. By examining real-world case studies, Hara will demonstrate how this technique can be used to enhance PCB durability and improve the overall engineering process.

This session is highly recommended for professionals in the PCB manufacturing industry, including engineers, designers, and quality control teams, looking to better understand the importance of mechanical stress measurement and how it can impact the success of their PCB assembly and mounting processes.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com 

SAN JOSE, CA – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, proudly celebrates a landmark year in the space industry. In 2024, Naprotek advanced manufacturing capabilities played a vital role in 18 successful space launches, reinforcing the company’s commitment to innovation and excellence in space technology.  

Naprotek has solidified itself as a trusted partner to the world’s most ambitious space launch vehicle companies. By manufacturing mission-critical controller cards and electronic systems for its customers’ launch vehicles, Naprotek ensures seamless mission execution and operational reliability, directly contributing to the success of these 18 launches.  

“Space exploration demands absolute precision, high reliability, and innovation—values that Naprotek embodies at every stage of our manufacturing process,” said Teh-Kuang Lung, President and CEO of Naprotek. “The remarkable number of successful launches in 2024 is a testament to our unwavering dedication to quality and our strong partnerships with top-tier space industry leaders.”  

As the demand for advanced space technology accelerates, Naprotek remains at the forefront of manufacturing, offering mission-critical solutions that support both commercial and government space programs. Leveraging decades of expertise in manufacturing high-reliability electronics, Naprotek continues to develop and deliver advanced electronics that withstand the extreme conditions of spaceflight.  

With space exploration entering an exciting new era, Naprotek is poised to expand its role as a key supplier in the aerospace industry, enabling next-generation launch vehicles and deep- space missions. Through precision engineering, rigorous quality control, and forward-thinking innovation, Naprotek is proud to support the visionaries shaping the future of space travel.  

For more information about Naprotek and its high-reliability manufacturing services, please visit www.naprotek.com or contact our support team.