NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Michigan Expo and Tech Forum, scheduled to take place Tuesday, August 27, 2024 at Laurel Manor in Livonia, Michigan. During the event, the KYZEN Clean Team will highlight understencil cleaner KYZEN E5631J and inline cleaning solution AQUANOX A4618.

KYZEN provides cleaning solutions for every phase of PCB production with easy-to-use and effective cleaning solutions like KYZEN E5631J and AQUANOX A4618.

KYZEN E5631J is a ready-to-use alternative to IPA for removing all types of raw solder paste from stencils in online and offline stencil cleaning processes to ensure every print counts. The proven compatibility of E5631J covers an array of common stencils, cleaning equipment and printer manufacturers.

AQUANOX A4618 is a low VOC aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues including no-clean and Pb-free residues. A4618 is effective at lower concentrations and temperatures in addition to proving safe for multi-pass applications.

For more than 30 years, KYZEN has met unique cleaning challenges in a variety of PCB production processes by developing and providing innovative and effective chemistries like KYZEN E5631J and AQUANOX A4618.

For more information, visit www.kyzen.com 

LAKE FOREST, CA – Semi-Kinetics, a leading provider of electronic manufacturing services, is proud to announce the installation of the new Epilog Fusion Pro Laser machine at its California facility. This state-of-the-art equipment is set to significantly enhance the company’s production capabilities, offering high precision, speed and versatility for a wide range of industrial applications.

The Fusion Pro Laser Series features remarkable engraving speeds of up to 165 inches per second (IPS), 5g acceleration, and a variety of wattage configurations to meet diverse production needs. The introduction of this advanced laser technology is a key step in Semi- Kinetics' commitment to continuous improvement and innovation in manufacturing processes.

"The Fusion Pro Laser technology not only enhances our production capabilities but also allows us to offer a broader range of services to our clients,” stated Michael Wayne Leedom, President – CEO at Semi-Kinetics. “We are excited to see how this investment will enable us to meet the growing demands of the industries we serve, while continuing to deliver the highest quality products."

Key Features of the Fusion Pro Laser Machine:

• IRIS™ Camera System: The Fusion Pro series comes equipped with Epilog’s revolutionary IRIS™ Camera System. This cutting-edge technology provides operators with a live-preview of the engraving table, enabling precise positioning and registration of artwork on even the most uniquely shaped items. This feature dramatically reduces setup time and increases accuracy, ensuring high-quality results with every use.
• Industrial-Grade Performance: Designed for industrial environments, the Fusion Pro Laser machines are engineered to handle a wide range of engraving, cutting, and marking tasks with unmatched efficiency. With speeds up to 165 IPS and various wattage configurations, these machines are ideal for businesses seeking to improve workflow and productivity.
• Versatility: The Fusion Pro Laser machines are highly versatile, capable of working with a variety of materials including wood, acrylic, fabric, metal, and more. This versatility allows Semi-Kinetics to expand its service offerings and cater to a broader customer base with diverse product needs.

The addition of the Fusion Pro Laser machine aligns with Semi-Kinetics’ strategic goals of increasing productivity, reducing lead times, and expanding its range of service offerings. By integrating this cutting-edge laser technology into its operations, Semi-Kinetics is poised to deliver even higher quality products to its customers, while also opening new avenues for innovation and market expansion.

For more information about Semi-Kinetics and its range of electronic manufacturing services, please visit https://semi-kinetics.com/ 

SAN JOSE, CA – NextFlex, America’s Hybrid Electronics Manufacturing Innovation Institute focused on additive microelectronics manufacturing for novel applications and complex integrated systems, announced the appointment of Dr. Daniel Gamota, a well-known and experienced manufacturing and technology executive, to lead NextFlex into its next chapter as Executive Director, effective September 1, 2024. Dr. Gamota succeeds Dr. Malcolm Thompson, the inaugural Executive Director of NextFlex.

NextFlex leads a consortium of companies, academic institutions, non-profits, state and local governments, and federal government agencies that collaborate to advance the technology, manufacturing, and commercialization of hybrid electronics, to establish a sustainable domestic manufacturing ecosystem in support of the technology, and to accelerate the growth of the current and future manufacturing workforce. Established in 2015 in San Jose, CA, NextFlex is a public-private partnership supported by the U.S. Department of Defense under a Cooperative Agreement with Air Force Research Laboratory (AFRL) and is part of the Manufacturing USA® network.

"On behalf of NextFlex, I’m delighted to announce Dr. Gamota’s appointment to lead the NextFlex Manufacturing Innovation Institute into its next phase. Having been an active and long-standing member of NextFlex through his role at Jabil, Dr. Gamota consistently demonstrates his strategic support for the mission of the Institute and its members and partners," said Dr. Robert Smith, Boeing Executive Technical Fellow, and Chair of the NextFlex Governing Council. "Hybrid electronics technology is at a critical inflection point – as it increasingly is integrated into volume manufacturing for both commercial and defense applications, it’s more important than ever that NextFlex continues to align the manufacturing ecosystem and accelerate the growth of the workforce of tomorrow."

Dr. Gamota has more than 25 years of experience leading large organizations such as Jabil, where he served as Vice President, and Motorola, where he served as Director & Fellow of the Technical Staff, both of which industrialized innovative products and deployed advanced microelectronics manufacturing operations to international high volume production sites. He is recognized for leading R&D and collaborative innovation teams spanning Semiconductor Foundry (middle end of line and backend of the line), Semiconductor Assembly, Packaging & Test, Complex Integrated Systems Assembly, and Printed Circuit Board Assembly operations. Dr. Gamota is a proven P&L leader of global engineering, operations, and business teams that developed, deployed, and sustained microelectronics-based product manufacturing that resulted in revenue growth, expanded margins, and increased free cash flow.

Dr. Gamota has a strong record being awarded and leading several multi-member microelectronics systems solutions development programs (DARPA, NIST ATP, etc.). He is a member of the SEMI Board of Industry Leaders, University of Michigan MSE External Advisory Board, and San Jose State University Engineering Industry Advisory Council, providing strategic technology, market, and workforce development guidance. Also, Dr. Gamota is active in and has chaired committees developing microelectronics guidelines, standards, and roadmaps for IEEE, iNEMI, IPC, IEC, A*STAR, and SEMI.

Dr. Gamota was elevated to a NextFlex Fellow, IEEE Fellow, and was named a Dan Noble Fellow at Motorola for his contributions and leadership in microelectronics design, materials, packaging, processes, manufacturing, assembly, and testing. He earned a Ph.D. in engineering from the University of Michigan and a Master of Business Administration from the Kellogg School of Management at Northwestern University.

"I am excited to lead NextFlex as it evolves to become an engine for product industrialization and commercialization of a portfolio of innovations, a pipeline for talented workforce, and a strategic partner to volume manufacturing services providers and OEMs. NextFlex has the foundational tenets - talent, funding, programs, operational structure, and facility - to ensure it continues to be globally recognized as the nexus for Hybrid Electronics innovation," said Dr. Gamota. "I believe that NextFlex must continue to demonstrate agility in navigating the multidimensional complexities impacting the Electronics Manufacturing Ecosystem: workforce, supply chain resiliency, sustainability, and technology innovation. I also look forward to leading the NextFlex community as it continues to foster strong collaboration with Ecosystem members that represent diverse industry, academic, and government groups driving key enabling R&D topics."

Dr. Gamota’s appointment marks the beginning of NextFlex’s tenth year of operations. During this time, NextFlex has grown its membership to more than 210 organizations, managed over $400M in 240 technology and manufacturing development projects, served more than 25,000 students around the country with its education and workforce development programs, established three regional U.S. nodes in Massachusetts, Missouri, and New York, outfitted an end-to-end pilot scale design, prototype and manufacturing facility in Silicon Valley, and produced annual technology and manufacturing roadmaps to guide and de-risk investment for the member community.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum taking place September 11 and 12 at Expo Guadalajara Salón Jalisco Hall D & E, Guadalajara, Jalisco Mexico. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Technical Support Engineer David Solis will be giving a presentation titled Addressing Challenges and Solutions for M0201, 008005 and Micro/MiniLEDs:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Guadalajara Expo & Tech Forum at Booth 110 September 11-12th, or visit www.aimsolder.com