Press Releases
CHICAGO, IL – Bimos, a leading provider of ergonomic ESD seating solutions, is pleased to announce the appointment of Z TECH SERVICES, INC. as its newest representative.
Established in 1993, Z TECH SERVICES serves a wide range of states, including Illinois, Indiana, Wisconsin, Iowa, Missouri, Kansas, and Nebraska, with a dedicated sales staff known for its experience and technical expertise.
With this new partnership, Bimos expands its reach and enhances its ability to serve clients in key regions across the United States. Z TECH SERVICES brings a wealth of knowledge and a commitment to providing efficient and effective sales support to its clients.
Bimos is renowned for its range of ESD seating solutions, including the acclaimed Neon, Nexxit, and Labsit series. These products are specifically designed to meet the rigorous demands of the electronics industry, offering unmatched comfort, durability, and ergonomic support. Bimos' commitment to design innovation, exceptional quality, safety certifications, and ergonomic excellence makes its seating solutions the preferred choice for businesses seeking to invest in the health and productivity of their employees.
"We are excited to welcome Z TECH SERVICES to the Bimos family," said Mark Scelfo US Managing Director at Bimos. "Their extensive experience and dedication to customer service align perfectly with our values, and we are confident that together, we will continue to provide outstanding seating solutions to our clients in the electronics industry."
For more information about the Bimos Stool System and other ergonomic seating solutions from Bimos, please visit www.bimos.com
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
CLINTON, NY – Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Payne’s presentation, scheduled for May 9, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.
High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials. Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.
“The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability,” said Payne. “With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.”
Payne is responsible for driving the profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, celebrated its 30th anniversary during the recent 2024 IPC APEX EXPO.
During the expo, Michelle Ogihara, Executive Vice President of Seika Machinery, had the opportunity to discuss the company's achievements over the past three decades with Mike Konrad from the Reliability Matters Podcast. The insightful conversation provided a platform to reflect on Seika Machinery's evolution as a prominent player in the manufacturing industry and its continued dedication to delivering cutting- edge technologies to the North American market.
Specializing in identifying, marketing, and distributing leading technologies from Japan to the North American market, Seika Machinery has established itself as a trusted partner for manufacturers seeking advanced solutions to enhance their production processes. Representing renowned brands such as Hioki, Sawa, McDry, Sayaka, Malcom, Unitech, Seitec, Tamura, Kyowa, Musashi, Tsuchiyama, Eightech, and more, Seika Machinery offers a comprehensive range of equipment and services tailored to meet the diverse needs of its customers.
Seika Machinery not only provides cutting-edge equipment but also delivers world-class support encompassing sales, engineering, and technical assistance. With a focus on customer-centricity and continuous improvement, Seika Machinery is dedicated to empowering manufacturers with the latest technologies and solutions to drive efficiency, productivity, and success.
To view the podcast, visit https://www.youtube.com/watch?app=desktop&v=DRcbTZSJmic&list=PLZ8gWrbK9R7lF9jKeK28UzWmr w8SNRl8q&index=13
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com
DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is thrilled to announce the expansion of its sales representation with the addition of three industry-leading firms: TECHNICA, COPE, and EMC3. This strategic expansion will bolster StenTech's ability to serve key territories across the United States with world-class expertise and support.
TECHNICA, covering the NorCal/West USA region, brings extensive experience and a commitment to providing customers with top-performing products and service excellence. Jeff Forster, Account Manager at TECHNICA, expressed excitement about the collaboration, stating, "As the leading provider of stencil and tooling technologies, StenTech is well- recognized for delivering best-in-class products and service. We look forward to working together to provide our customers with leading-edge quality stencils and tooling required in today's ever-changing applications." To learn more about TECHNICA, visit www.technica.com
COPE, servicing the Mid-East US, is dedicated to delivering innovative solutions to its customers. Travis Cope, Partner at COPE Assembly Products, emphasized the strategic alignment between the two companies, stating, "We saw the opportunity to join forces with a technology leader and driver in the industry for stencils, fixtures, and pallets. The combination of COPE Assembly Products and StenTech will lead to success in the region." For more information about COPE, visit www.copeassemblyproducts.com
EMC3, taking charge of Florida, brings a wealth of knowledge and expertise to the partnership. Steve Pattison, Partner at EMC3 Group, highlighted the comprehensive capabilities and turnkey solutions offered by StenTech, stating, "The EMC3 Group is very pleased and excited about the potential that StenTech brings to our organization. We were attracted to the comprehensive capabilities for multiple stencil types, the variety of tooling options offered, and the turnkey solutions StenTech brings to the electronics manufacturing and assembly markets." To learn more about EMC3, visit, www.emc3group.com
StenTech is committed to providing its customers with the highest quality products and service excellence, and this expansion of sales representation emphasizes that commitment. The company looks forward to a fruitful collaboration with TECHNICA, COPE, and EMC3, and to better serving its customers in these important regions.
For more information about StenTech, visit www.StenTech.com
WESTMORELAND COUNTY, PA – Intervala, a premier full-service electronics manufacturing services provider, and Westmoreland County Community College (Westmoreland), an accredited public community college headquartered in Youngwood, Pa., have teamed up to create a comprehensive electronics technician training program.
Westmoreland’s Workforce Development team worked with Intervala’s senior engineering staff to develop the program curriculum, which focuses on providing the practical knowledge, circuit theories and hard skills required in professional electronics technicians. Coursework and laboratory training are conducted at Intervala’s manufacturing facility in Mount Pleasant, Pa.
Intervala contacted Westmoreland with the idea for the training program to support the company’s expanding need for skilled technical staff. Collaborating with Byron Kohut, Ed.D., dean of the School of Technology, Intervala was able to design a program to meet the needs of its current staff and provide a pathway for those who may wish to pursue a degree or additional training.
“Our customers are leading innovators in the defense, medical, industrial, semicap, and other technology-driven industries,” said Teresa Huber, Intervala president and CEO. “The increasing sophistication of their products demands Intervala be committed to continuously upskilling our workforce and capabilities. In this case, that’s meant hands-on involvement in developing the workers we need to serve our customers. The program will help our current technicians take their skills to the next level and maintain the high level of quality and reliability we need on the production floor.”
“Our partners around the region know that we are here to support their training needs,” said Tuesday Stanley, Ed.D., president of Westmoreland County Community College. “Our Workforce Development team works directly with companies to help them develop their staff, increase their skills and, overall, create a highly skilled workforce in the region, often providing recruitment opportunities for students. This partnership with Intervala highlights the investment by Intervala and its team and the forward-thinking approach to advancing the workforce of the region by the community college.”
JENA, GERMANY – GOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024. Attendees are invited to visit booth 4A-227, where we will discuss latest developments in quality assurance and present how flexible THT and SMT inspection equipment can be configured to meet specific, and often unique, electronics manufacturing requirements.
GOEPEL electronic’s THT Line · 3D is a reliable AOI solution for the inspection of THT components, THT solder joints, and wave soldered SMT components. While a top-side camera module inspects THT components for presence, correctness, and alignment, a second 3D camera module below the transport conveyor simultaneously and independently inspects THT pins and solder joints, alleviating the need to flip the PCB-A. The latest version of this system features telecentric optics for optimal imaging quality with frequently changing board designs and transport carriers. The system’s Reflex Reducer enables the measurement of critical solder joints and pins whose observation was previously only possible to a limited extent or not at all.
The efficient MultiEyeS plus automatic optical inspection (AOI) module has been amended with augmented reality (AR) based assembly assistance. A laser projector integrated into the AOI module provides guidance by displaying placement information, such as position or component type, directly in the operator's field of vision. Reproducible and reliable failure detection, directly at THT assembly stations in conjunction with AR-based assistance, ultimately helps to continuously improve the quality of products that include manual assembly steps.
Vario Line · 3D X300 distinguishes itself through superior failure detection and high test speed. The system is available with a new 3D camera module, providing excellent optical quality regarding projection and image capture. The system’s 3D technology allows measurement of components up to 35 mm tall as well as the inspection of optically critical surfaces with a large dynamic range.
Software plays a key role in AOI and AXI solutions. GOEPEL electronic’s new AOI system software PILOT AOI Version 7 provides numerous new functions, with focus on performance and ease-of-use. This software is capable to automatically generate Gerber data from a bare board, which especially helps small and medium-sized CM/EMS companies which may do not have access to such data. The award- winning MagicClick function can then be used to automatically generate inspection programs.
GOEPEL electronic’s presence at the show will also include live demonstrations of electrical test and programming applications from the company’s Embedded JTAG Solutions division. The stand-alone programmer FlashFOX, which has been honored with the productronica innovation award, is a groundbreaking embedded in-system programming (ISP) solution in terms of time and cost reductions for electronics manufacturing. FlashFOX can program a variety of components including microcontrollers, flash components, and PLD/FPGA which are mounted on PCB-A.
The range of embedded JTAG solutions is complemented by the JTAG Unlimited Tester, JULIET, for electrical test in manufacturing. The desktop tester contains all necessary system electronics and features quick DUT adaptation using an exchangeable fixture cassette, all in a compact form factor.
GOEPEL electronic develops and manufactures innovative electrical and optical measurement and test technology, as well as test and inspection systems, for electronic components and printed circuit board assemblies, and industrial and automotive electronic systems. GOEPEL electronic comprises four business units:
- Automotive Test Solutions
- Embedded JTAG Solutions
- Inspection Solutions AOI-AXI-SPI-IVS
- Industrial Function Test
The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with about 240 employees.
Further information: www.goepel.com/en
Press Releases
- KYZEN to Feature KYZEN E5631J and AQUANOX A4618 at SMTA Michigan Expo and Tech Forum
- Semi-Kinetics Enhances Production Capabilities with New Epilog Fusion Pro Laser
- NextFlex Announces Appointment of Dr. Daniel Gamota as Incoming Executive Director to Lead Hybrid Electronics Manufacturing Institute
- AIM to Present on Micro/MiniLED Applications and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Guadalajara Expo & Tech Forum