CAMBRIDGE, UK – With the ever-increasing need for heat dissipation, high-performance thermal interface materials (TIMs) with higher thermal conductivity and other properties are becoming essential. Driven by this trend, a number of high-performance TIMs are emerging. This article primarily introduces the advantages and drawbacks of advanced carbon-based TIMs. However, it is worth noting that many other TIMs offer superior performance. The recent TIM market report from IDTechEx, “Thermal Interface Materials 2024-2034: Technologies, Markets, and Opportunities”, offers a holistic view of the TIM industry.

Carbon-based TIMs overview

Carbon materials provide high thermal conductivity as raw materials. The raw carbon fillers often have a thermal conductivity over 1000 W/m·K (in-plane rather than through-plane). Within the scope of carbon-based high-performance TIMs, the main competitors include carbon fiber, graphite, carbon nanotubes, and graphene. There is also emerging interest in diamond-based TIMs.

Graphite-based TIMs: graphite sheets and graphite TIMs

Graphite is a highly thermally conductive material, extensively used as a heat spreader (XZ in-plane to prevent hot spots). Typical examples include phone batteries or displays where a thin layer of graphite is used.

There are also instances of graphite acting as a TIM, either by using it for conductive fillers or modifying the sheets to provide some through-plane advantages (which blurs the line between a TIM and a heat spreader).

Graphite has excellent in-plane conductivity (x-y) but relatively poor through-plane (z) conductivity. This property is beneficial for avoiding hot spots and achieving good homogeneity, which is why it is frequently used in smartphones. However, it is not effective for the key challenge of dissipating heat from the source.

One example of a graphite sheet product is NeoGraf's HITHERM, which has an in-plane conductivity of around 800 W/m·K (note that other players claim values over 1000 W/m·K) but is limited to 7 W/m·K through-plane. To enhance the through-plane thermal conductivity of graphite sheets, vertically aligned graphite could potentially be used. However, the cost would increase significantly; IDTechEx has noticed that the cost per m² can increase by 10 times for vertical graphite compared to regular graphite sheets.

Another commonly used graphite-based TIM is graphite paste, where graphite is used as a thermal filler. Graphite pastes typically have a thermal conductivity between 5 and 15 W/m·K, with a retail price between US$0.03/ml and US$3/ml, depending on the quality and purity of the graphite, quantity purchased, supplier, and other factors. It is worth noting that this cost is estimated by IDTechEx, and there might be some outliers. For a more detailed cost analysis, please refer to IDTechEx’s research report, “Thermal Interface Materials 2024-2034: Technologies, Markets, and Opportunities”.

Boron nitride-based TIMs

Boron Nitride (BN) has always been a fascinating filler material for enhancing thermal conductivity. It exhibits a remarkable thermal conductivity of up to 600 W/m·K (although many are around 300 W/m·K), which is significantly higher than many other materials, and is electrically insulating. Furthermore, BN is non-toxic and possesses excellent chemical and thermal stability, capable of withstanding temperatures above 1000°C without degradation. This stability simplifies its handling and storage when compared to other filler materials, reducing the risk of chemical reactions or safety hazards.

The form of BN used, such as hexagonal BN (h-BN) or cubic BN (c-BN), can impact its performance. Hexagonal BN, for example, is known for its layered structure that promotes high thermal conductivity while minimizing agglomeration. This is particularly true if the synthesis process maintains minimal impurities, enhancing the material's dispersion within a composite.

However, the primary barrier to the widespread adoption of BN fillers is their high cost. BN fillers typically range from US$50/kg to US$65/kg, influenced by factors such as volume, supplier, purity, and form. These costs are considerably higher compared to other fillers, leading to their use as secondary rather than primary fillers in many applications. This economic constraint means that BN is often incorporated in smaller quantities to achieve the desired thermal conductivity improvements without significantly increasing the overall cost of the material. A more detailed comparison of BN’s thermal conductivity, density, dielectric strength, and use cases is included in “Thermal Interface Materials 2024-2034: Technologies, Markets, and Opportunities”.

Conclusion

As the demand for efficient heat dissipation continues to rise, the need for high-performance TIMs with superior thermal conductivity and other critical properties becomes increasingly evident. This article has highlighted the advantages and limitations of advanced carbon-based TIMs, such as graphite, carbon fiber, carbon nanotubes, and graphene. Graphite sheets, known for their high thermal conductivity, play a significant role in heat management solutions, though they face challenges with through-plane conductivity.

In addition to carbon-based TIMs, boron nitride (BN) stands out for its impressive thermal conductivity, electrical insulation, and exceptional chemical and thermal stability. Despite these advantages, the high cost of BN fillers, ranging from US$50/kg to US$65/kg, limits their widespread adoption, often relegating them to secondary filler roles in various applications.

To gain a comprehensive understanding of the TIM industry and explore the latest advancements, technologies, market trends, and opportunities, refer to IDTechEx’s latest research, “Thermal Interface Materials 2024-2034: Technologies, Markets, and Opportunities”. This resource provides an in-depth analysis of various TIMs, including detailed comparisons of thermal conductivity, density, dielectric strength, and use cases, offering valuable insights for professionals and researchers in the field.

Cranston, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Chihuahua Expo & Tech Forum taking place on August 15 at Hotel Sheraton Soberano in Chihuahua, Chihuahua Mexico. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Chihuahua Expo & Tech Forum on August 15th, or visit www.aimsolder.com 

SHINGLE SPRINGS, CA – PDR Americas X-RAY Systems is pleased to announce the appointment of Bob Pearson from PAC-Global Texas as the new representative for the Central Texas region, encompassing Austin and San Antonio. Pearson will provide sales and service for PDR's advanced rework and X-ray inspection systems.

PDR is renowned for its advanced rework and systems and X-ray technology for non-destructive testing. These industry-leading solutions enable electronics manufacturers to achieve reliable and efficient assembly processes while ensuring the highest quality standards.

PAC-Global, headquartered in Dallas, Texas, has been a leading manufacturing representative since 1973, providing top-tier manufacturing equipment to the electronics industry. With 43 years of experience, PAC-Global has expanded to six offices across the Southwestern United States and Mexico, establishing a strong presence and reputation in the industry.

With more than 32 years of industry experience, Osborne is a certified Process Engineer through the Surface Mount Technology Association (SMTA). His extensive background and deep understanding of the electronics manufacturing process make him an invaluable asset to PDR. Osborne’s expertise will enable electronics manufacturers to achieve reliable and efficient assembly processes while maintaining the highest quality standards.

"We are thrilled to welcome Bob Pearson to the PDR family," said Dave White, CEO of White Industrial Corporation, parent company of PDR Americas. "His knowledge of the industry and PAC- Global’s reputation in Texas will allow us to provide world-class service to customers in the Central Texas region.”

PAC-Global’s mission has always been to provide cutting-edge solutions for PCB manufacturers. Their team of highly skilled professional sales associates and technical service engineers utilize superior training and state-of-the-art demo facilities to exceed industry standards. Every member of the PAC-Global team, from sales associates to field service engineers, application engineers, software engineers, and master trainers, is dedicated to delivering exceptional service to each client.

For more information, contact Bob Pearson at 830-743-2506 or visit www.pac-global.com

For more information about PDR Rework and its innovative solutions, please visit www.pdr- rework.com

TAMBARAM, INDIA – Avalon Technologies, a leading provider of electronic manufacturing services, is excited to announce the expansion of its PCB assembly and design services to better serve the increasing needs of its clients across various sectors. With a commitment to innovation and quality, Avalon Technologies aims to enhance its capabilities in response to the rapidly evolving electronics landscape.

As technology continues to advance at an unprecedented pace, the demand for high-quality printed circuit boards (PCBs) has surged. These essential components are integral to a wide range of applications, from consumer electronics to medical devices and industrial equipment. Avalon Technologies recognizes the importance of providing reliable and efficient PCB solutions to meet the diverse requirements of its clientele.

Comprehensive PCB Solutions
Avalon Technologies offers a comprehensive suite of PCB assembly and design services that encompass the entire product lifecycle. From initial design concepts to final production, the company ensures that every step is executed with precision and expertise.

Their services include:

PCB Design: The design team at Avalon Technologies employs advanced software tools and industry best practices to create optimized PCB layouts. Their focus on manufacturability and reliability ensures that designs are not only innovative but also practical for production.

Prototype Development: Avalon understands the critical role of prototyping in the product development process. The company provides rapid prototyping services, allowing clients to test and validate their designs quickly and efficiently.

Component Sourcing: With a vast network of suppliers, Avalon Technologies offers component sourcing services to ensure that clients have access to high-quality materials at competitive prices. This capability streamlines the supply chain and reduces lead times.

PCB Assembly: Utilizing state-of-the-art equipment and techniques, Avalon Technologies specializes in both surface mount technology (SMT) and through-hole assembly. Their skilled technicians ensure that every PCB is assembled to the highest standards of quality and reliability.

Testing and Quality Assurance: Quality is paramount at Avalon Technologies. The company employs rigorous testing protocols, including automated optical inspection (AOI) and functional testing, to ensure that every PCB meets stringent performance criteria before delivery.

Commitment to Innovation
Avalon Technologies is dedicated to staying at the forefront of technological advancements in the electronics industry. The company continuously invests in the latest manufacturing technologies and equipment to enhance its capabilities. This commitment to innovation allows Avalon to offer cutting-edge solutions that meet the evolving needs of its clients.

In addition to expanding its service offerings, Avalon Technologies is also focused on sustainability. The company is implementing eco-friendly practices throughout its manufacturing processes, including waste reduction and energy-efficient operations. By prioritizing sustainability, Avalon aims to minimize its environmental impact while delivering high-quality products.

Meeting Industry Demands
The expansion of Avalon Technologies' PCB assembly and design services comes at a time when the electronics industry is experiencing significant growth. With the rise of smart devices, IoT applications, and advancements in medical technology, the demand for reliable and efficient PCB solutions is more critical than ever.

At Avalon Technologies, we understand the importance of delivering high-quality PCBs that our clients can rely on, Our expansion in PCB assembly and design services reflects our commitment to meeting the growing demands of the industry and providing our clients with the best possible solutions."

Client-Centric Approach
Avalon Technologies prides itself on its client-centric approach. The company works closely with clients to understand their unique needs and challenges, ensuring that the solutions provided are tailored to their specific requirements. This collaborative approach fosters long-term partnerships and drives mutual success.

Looking Ahead
As Avalon Technologies continues to expand its capabilities in PCB assembly and design, the company remains focused on delivering exceptional value to its clients. With a dedicated team of experts and a commitment to quality, Avalon is well-positioned to meet the demands of the evolving electronics landscape.

For more information about Avalon Technologies and its expanded PCB assembly and design services, please visit www.avalontec.com