CYPRESS, CA – Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, to announce its participation in the 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center. Visitors are invited to Booth #2142 to explore Hanwha Techwin’s full range of advanced PCBA solutions designed to deliver industry- leading productivity, flexibility, and efficiency.
At this year’s APEX, Hanwha Techwin will spotlight the following innovations:
High-Speed HM520 Solution
The HM520 high-speed solution, validated by multiple Tier 1 EMS customers, will be on display in its traditional dual-lane setup at the booth, showcasing its exceptional Overall Equipment Effectiveness (OEE). Additionally, Hanwha’s industry-first different-board dual-lane configuration will be demonstrated at the Hanwha Center of Excellence. Private demonstrations are available by appointment, with Jonny Nichols, Hanwha’s Vice President of Marketing.
High-Flexibility XM520 Solution
The XM520 solution is engineered for flexibility, supporting a wide range of board and part sizes. Available in both dual-lane and single-lane configurations, the XM520 includes a side-tray feeder for added part feeding capability. For manufacturers requiring odd-form component handling, the XM520F option offers advanced capabilities. Production-validated at Tier 1 EMS customers, this solution provides an outstanding return on investment.
ESE E2 Screen Printer
With 28 years of proven screen printer technology, the ESE E2 is designed, manufactured, and rigorously tested in Korea to ensure the highest quality. It supports a wide range of PCB and stencil mask sizes with industry-leading alignment accuracy and printing repeatability, making it an ideal choice for high-precision operations.
Material Storage Solutions
Hanwha Techwin’s Neotel material storage solutions will also be featured, demonstrating how they enhance efficiencies in PCBA operations. Factory floor operations, including the full range of material storage solutions, will be simulated at the Hanwha Center of Excellence, where live demonstrations are available.
Schedule a Demonstration
For private demonstrations of the high-speed dual-lane solution or any of the showcased technologies, attendees are encouraged to contact Jonny Nichols at jonny.n@hanwha.com to setup a time.
From high-speed pick-and-place machines to flexible assembly solutions and material management systems, Hanwha Techwin provides end-to-end solutions for modern manufacturing challenges.
To learn more, join Hanwha Techwin at Booth 2142 at the 2025 IPC APEX EXPO. More information is available at www.hanwha-pm.com
HAMAMATSU, JAPAN – Yamaha Robotics SMT Section invited its European distributors to its headquarters in Hamamatsu, Japan for the 2025 Distributors Meeting, giving team-members the opportunity to visit the new facilities in the recently expanded factory and celebrate its 40th anniversary.
“With our anniversary and the recent significant new investment in R&D and manufacturing at Hamamatsu, we had two good reasons to invite our distribution network partners to Japan,” said Shuichi Imai, who joined Yamaha Robotics’ European team as SMT Section Sales General Manager in 2024. “The visit also showed the progress made in sustainability, such as our adoption of green steel in equipment manufacturing and new waste-reduction and recycling strategies.”
The delegates saw how the investment has approximately doubled the production capacity for surface mounters, while extensive electrification combined with greater adoption of solar panels will make the site Yamaha’s first carbon-neutral factory. They also previewed upcoming surface-mount equipment innovations, including new printer, dispenser, mounter, and inspection features as well as the latest software updates.
The meeting concluded with the traditional awards ceremony, recognising the top performers in the European network. Prime Option, distributor for Ireland, received the Best Service award. Renex, which covers Poland, Romania and Slovenia, was awarded Most Valuable Distributor, and ProSMT of Türkiye received the Special Achievement award.
Concluding the event, Mr Imai said, “We are delighted at the total commitment we see from all our distribution partners, which continues to drive the business forward in Europe. I hope the time spent together, in Japan this year, has added a new energy to continue our mission.”
HAVERHILL, MA – Seica, Inc. is excited to announce its participation in the upcoming 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025, at the Anaheim Convention Center in Anaheim, California. Visitors to Booth #3205 will experience Seica's Pilot VX flying probe test platform and the Compact SL in-line bed-of-nails tester presented in a fully automated configuration, alongside real-time data insights powered by the Canavisia Dashboard.
Automation is now critical for optimizing manufacturing processes, and Seica remains at the forefront of delivering advanced test solutions. The integration of Seica’s platforms with the VIVA Integrated Platform (VIP™) allows a seamless combination of testing technologies to achieve maximum throughput and test coverage in the shortest possible time.
The Pilot VX, Seica’s flagship flying probe system, showcases cutting-edge mechanical architecture and motion controllers, reducing test times by up to 50%. Equipped with 12 multi-function test heads, the Pilot VX enables double-sided probing of up to 44 points simultaneously. Advanced hardware, such as a microwave-based measurement technique and unique options like the FlyPod and FlyStrain™, enhances its testing capabilities further. The FlyPod option specializes in mobile probes with up to 14 channels, while FlyStrain™ maps pressure/force topologies on devices under test.
The Compact SL is engineered to deliver maximum configurability and customization, addressing a comprehensive range of test requirements, including in-circuit, functional, and combinational testing. It supports advanced tasks such as onboard programming (OBP), combining speed and flexibility to meet the rigorous throughput demands of today’s manufacturing environments. With the latest ATE BOOSTER module, this system enhances LED testing and OBP performance while minimizing hardware resource costs.
On display will also be Seica’s DeviceClip; a universal ISP (In-System Programming) programming tool designed for programming all types of semiconductor devices (microcontrollers, serial memories, programmable logic devices) from any semiconductor manufacturer. The solution is modular and can be configured to provide up to 64 parallel, totally independent, multi-protocol ISP channels, and is provided with an embedded control panel compatible with any operating system. Its integrated high-performance microcomputer enables DeviceClip to reach the maximum programming speed of any device, and each channel within the module can be configured to support totally different targets ensuring an extremely high level of flexibility. The DeviceClip can be operated in a workbench standalone scenario or integrated into any of our test platforms, such as the Pilot VX or Compact line of testers.
Introducing the Canavisia Dashboard for Real-Time Monitoring
In addition to showcasing its industry-leading test solutions, Seica will demonstrate its Canavisia Dashboard, a digital monitoring platform that provides real-time data acquisition and visualization. At Booth #3205, the Canavisia Dashboard will be connected to both the Pilot VX and Compact SL systems, streaming live data directly to an iPad. This capability highlights how production or facilities managers can monitor critical metrics remotely—right from their hands—ensuring optimized processes and enhanced decision-making.
The Canavisia Dashboard delivers intuitive, user-friendly analytics for industrial monitoring and energy management. It enables manufacturers to track key production metrics, monitor equipment performance, and analyze energy consumption in real time. This level of visibility and control helps streamline operations, reduce downtime, and improve overall efficiency.
Interactive Demonstrations at Booth 3205
Visitors to Seica’s booth will witness live demonstrations of how these systems streamline processes with seamless board handling between the Compact SL and the Pilot VX. A dedicated monitor on Seica’s storage wall will display real-time performance data, offering a comprehensive view of the systems’ capabilities. By combining advanced automation with the power of live data streaming through the Canavisia Dashboard, Seica provides a holistic solution for next-generation electronics manufacturing.
For more information, visit www.seica.com
NEW YORK, NY – Kubler US Corp, a leader in high-tech electronics solutions and strategic market development, is proud to announce its participation in IPC APEX EXPO 2025. Attendees can explore the groundbreaking Arcadia Smart Storage Solutions across three booths: Kubler US Corp at Booth #1644, SMarTSol at Booth #1820, and Essemtec USA at Booth #2148. This multi-booth presence highlights the growing momentum behind Arcadia’s innovative approach to inventory control and production efficiency.
The Arcadia Smart Storage Solutions, known for their unmatched efficiency, automation, and Industry 4.0 integration, are revolutionizing material management for electronics manufacturers. Designed to optimize factory operations, the Arcadia system enables:
“We are thrilled to exhibit the Arcadia Smart Storage Solutions at APEX 2025. With three booths showcasing its capabilities, attendees will have the opportunity to see firsthand how this technology transforms production efficiency,” said Boris Kubler, CEO of Kubler US Corp. “Whether it’s SMarTSol, Essemtec, or our team at Kubler US Corp, visitors will experience the future of smart material management.”
Three Booths – One Revolutionary Solution!
Kubler US Corp, along with its partners, invites manufacturers, industry leaders, and attendees to witness Arcadia’s industry-defining technology in action. From optimizing inventory to reducing manual processes, Arcadia delivers measurable ROI and supports smart factory initiatives.
Event Details
For more information or to schedule a demo, contact Boris Kubler at boris@kubler-us.com or visit www.kubler-us.com
SINGAPORE – SP Manufacturing Pte Ltd., a leader in comprehensive electronic manufacturing services, is excited to announce its participation in the upcoming 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center. The event offers SP Manufacturing an opportunity to highlight its innovative manufacturing capabilities. Visitors are invited to Booth #842 to learn more about the company’s expertise and industry-leading solutions.
SP Manufacturing is a leader in high-quality PCBA, Cable Harness and Box Build Assembly services. The company is known for consistently achieving exceptional first-pass yields, ensuring that products meet stringent quality standards from the very first production run. This efficiency is a key driver of the company’s manufacturing excellence and customer satisfaction.
SP Manufacturing holds numerous industry- recognized certifications, including ISO 9001 for quality management, ISO 14001 for environmental management, ISO 13485 for medical device manufacturing, IATF 16949 for automotive manufacturing, and AS9100D for aerospace manufacturing. The company is also certified to IPC-A-610 and IPC/WHMA-A-620 standards and holds FDA, UL, and CSA certifications, further solidifying its reputation for maintaining the highest standards.
Equipped with advanced capabilities, SP Manufacturing provides a range of services, including electrical and functional testing, in-circuit testing, automated optical inspection (AOI), state-of-the-art cleaning processes, and rigorous inspection protocols. The company also specializes in rapid prototyping and expert assembly processes, ensuring it can meet the unique needs of its clients. Beyond its technical expertise, SP Manufacturing excels in supply chain management, ensuring the timely delivery of high- quality components.
Serving a broad range of industries, SP Manufacturing supports customers in sectors such as medical devices, automotive, aerospace and defense, industrial equipment, telecommunications, and renewable energy. This versatility underscores the company’s ability to adapt to the specific requirements of each market while maintaining excellence across all operations.
Visit SP Manufacturing at Booth #842 during IPC APEX EXPO 2025, where attendees can explore how the company continues to set new standards in manufacturing.
For more information about SP Manufacturing and its award-winning services, visit www.sp-manufacturing.com
OSAKA, JAPAN – Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce its participation in the 2025 IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025. Visitors to Booth #2206 will experience Nihon Superior’s latest breakthroughs in soldering technology, including the SN100CV® P608 solder paste, the LF- C2 lead-free alloy, and the TempSave™ series of low-temperature soldering materials, designed to meet the evolving needs of the electronics manufacturing industry.
SN100CV® P608 – High Strength and Halogen-Free
Nihon Superior’s SN100CV® P608 solder paste sets a new industry standard as a completely halogen-free, lead-free, and no- clean solution. Unlike traditional silver- containing alloys that rely on a dispersion of Ag3Sn particles, SN100CV derives its strength from solute atoms within the tin matrix, ensuring exceptional mechanical properties. In tensile tests, SN100CV matches the strength of SAC305, while offering high resistance to impact loading, making it ideal for a variety of applications.
The P608 flux medium delivers wetting performance comparable to halogen-containing pastes, offering excellent results across a wide range of components and process parameters. This makes SN100CV® P608 a robust, high-performance solution for manufacturers prioritizing reliability and halogen-free production.
LF-C2 Lead-Free Alloy – Superior Strength for High-Reliability Applications
For applications requiring strength beyond that of SAC305, Nihon Superior introduces the LF-C2 lead-free alloy. Combining both dispersion and solid solution strengthening, LF-C2 provides superior mechanical strength and reliability. With a liquidus temperature of 213°C, it enables reflow at a lower temperature compared to SAC305, addressing challenges related to energy consumption and thermal stress on components.
TempSave™ Series – Advanced Low-Temperature Solutions
The TempSave™ series offers next-generation low-temperature soldering materials designed to reduce energy use, minimize package warpage, and protect temperature-sensitive devices.
Nihon Superior’s continued innovation supports the industry’s goals of improving reliability, reducing energy consumption, and enhancing manufacturing efficiency. By combining high- performance alloys with advanced flux technology, the company delivers solutions that address the most demanding challenges in electronics production.
Visit Nihon Superior at Booth #2206 during IPC APEX EXPO 2025 to learn how these innovative soldering solutions can optimize your manufacturing processes and improve product reliability.
For more information, visit www.nihonsuperior.co.jp/english