SINGAPORE – ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools.

Chiplets deconstruct SOCs into their composite parts, creating smaller chips that can then be packaged together to operate as a single system, to provide potential benefits that can include improved energy efficiency, faster system development cycle time, and reduced costs. However, packaging advances are needed to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in AI computing.

This latest agreement builds on an existing collaboration between ASMPT and IBM, resulting last year in the debut of a new hybrid bonding approach* that optimizes bonding quality between two chiplets. Now, they will continue to work together on the development of bonding technologies for chiplet packages.

“IBM has been at the forefront of developing advanced packaging technology for the age of AI,” said Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, IBM Research. “We are proud to continue our work with ASMPT to advance chiplet packaging technology to pave the way for smaller, more powerful, and more energy efficient chips.”

“We are excited to build on our strong relationship with IBM to drive the frontiers of Advanced Packaging in tandem with accelerating innovations in artificial intelligence,” said Lim Choon Khoon, Senior Vice President, ASMPT. “We are pleased to work with IBM to advance next generation packaging and Heterogeneous Integration solutions for the AI era.”

AUBURN HILLS, MI – The Murray Percival Company, the premier manufacturer’s rep in the Midwest and one of the longest tenured distributors in the electronics industry, is pleased to announce its new partnership with BIMOS ESD seating. The Murray Percival Company will now represent BIMOS ESD seating solutions across Michigan, Ohio, Indiana, Kentucky, Illinois, Wisconsin, and Western Pennsylvania, enhancing their comprehensive product offerings.

BIMOS, renowned for its innovative and ergonomic seating solutions, designs chairs that prioritize comfort, durability, and safety, specifically tailored for laboratory and production environments. These high-quality seats are crafted to meet the stringent requirements of ESD (Electrostatic Discharge) protection, ensuring both employee well-being and the safeguarding of sensitive electronic components.

“We are thrilled to bring BIMOS ESD seating to our customers in the Midwest,” said Murray Percival III, Sales Manager at the Murray Percival Company. “The quality and ergonomic design of these seats are unparalleled in the market. BIMOS products not only enhance workplace safety and comfort but also contribute significantly to productivity and employee satisfaction. We believe they are the best on the market, and we are excited to provide such high-caliber solutions to our clients.”

The Murray Percival Company has always been dedicated to offering top-tier products and personalized support to its customers. With the addition of BIMOS ESD seating, they continue to demonstrate their commitment to improving workplace efficiency and safety. Customers can expect the same legendary service and expert guidance that the Murray Percival Company is known for, now complemented by the superior quality of BIMOS seating solutions.

This new representation signifies a strategic step for the Murray Percival Company, reinforcing their mission to provide the best possible solutions to their customers and staying at the forefront of industry innovations.

For further inquiries or to explore how The Murray Percival Company can address your PCB supply needs, please visit www.murraypercival.com 

NUEVO LEON, MEXICO – Selectronic Assembly is pleased to announce the appointment of Eliud Herrera as the new Production Manager. With a robust background in production management and a proven track record of driving efficiency and quality, Herrera brings a wealth of experience to his new role.

An accomplished professional with extensive expertise in various aspects of manufacturing and production, Herrera joins Selectronic Assembly with an impressive resume. His expertise spans across multiple areas, including the implementation of preventive maintenance plans, TPM (Total Productive Maintenance), and the development of internal operating documents.

In his previous role, Herrera successfully led a team of engineers and operators, establishing procedures and work instructions, and making fixtures for new product launches. Prior to that, he developed a track record for contributing significantly to process improvements and troubleshooting, showcasing his capability in handling SMT processes, wave solder processes, and conformal coating processes.

Herrera’s dedication to continuous improvement and his ability to manage complex manufacturing environments make him an invaluable addition to the Selectronic Assembly team. His leadership skills, coupled with his technical knowledge, will be instrumental in driving the company's production capabilities to new heights.

Selectronic Assembly is confident that Eliud Herrera will play a pivotal role in enhancing production efficiency, ensuring quality, and leading the company towards achieving its strategic goals.

SINGAPORE ― SP Manufacturing Pte Ltd., a leader in comprehensive electronic manufacturing services, is proud to announce the celebration of its 15th anniversary. The company commemorated this milestone with a grand "Move Fast, Move Smart, and Move Together" company dinner, gathering over 1000 participants to celebrate together. This event marked the largest gathering of the SP Manufacturing team to date, reflecting the company's growth and success over the years.

Since its inception, SP Manufacturing has emerged as a leader in the EMS (Electronics Manufacturing Services) industry, and this anniversary is a testament to the dedication, hard work, and passion of its team members. The company's journey from its humble beginnings to its current position as an industry leader has been remarkable, and it is a testament to the commitment of its employees and the support of its valued customers.

One of the key milestones in SP Manufacturing's journey has been the expansion of its facilities. The company has expanded its capacity by 100,000 square feet in Batam, Indonesia, and plans are underway for an additional 45,000 square feet facility in Malaysia. These expansions underscore SP Manufacturing's commitment to serving mission-critical industries and meeting the growing demand for its services.

As SP Manufacturing celebrates this significant milestone, the company looks forward to the future with great excitement. SP Manufacturing remains dedicated to pushing the boundaries of innovation and excellence, and it is poised to continue its journey of growth and success in the years ahead.

"This milestone would not have been possible without the hard work and dedication of our talented team and the support of our loyal customers,” said Jackson Tan, Global Business Development Director at SP Manufacturing. “As we look ahead, we are excited about the opportunities that lie ahead and remain committed to delivering exceptional service and value to our customers."

For more information about SP Manufacturing, visit www.sp-manufacturing.com