KREUZWERTHEIM, GERMANY – The most common soldering defects in wave soldering processes are errors due to poor wetting, especially if the assembly or the soldering mask layout is demanding. Depending on the mask thickness and size of the cut-outs, reliable wetting of all solder joints is not always guaranteed. In addition, small distances between the covered components and the pins of the components to be soldered can become a challenge.

Smart functions such as the automatic nozzle height adjustment of the SEHO MWS 2300 are an innovative solution for such applications. The height of the solder nozzles can be adjusted individually and software- controlled in order to always have the optimum distance between the PCB and the solder nozzle, depending on the product. Up to 16 different sections of an assembly can be processed with an individual nozzle height. This makes the entire process independent of the workpiece carrier or assembly design without affecting the cycle time. All solder joints can be reliably wetted, significantly reducing the risk of soldering defects.

As a result, the automatic nozzle height adjustment ensures additional process reliability and an improvement in product quality. At the same time, it offers maximum flexibility and thus ensures the future viability of the wave soldering system with regard to new applications.

For more information, visit https://www.seho.de/en/reliable-wetting-in-wave-soldering-processes/ 

WESTFORD, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce the appointment of E-Tronix as its representative in North Dakota (ND), South Dakota (SD), Minnesota (MN), Iowa (IA), Wisconsin (WI) and Illinois (IL).

E-Tronix, renowned for its exceptional service and expertise in the electronics manufacturing industry, will now represent BTU International’s state-of- the-art thermal processing solutions.

This partnership aims to strengthen BTU’s presence in these key regions, providing local manufacturers with enhanced access to BTU’s cutting-edge technology and customer support.

“E-Tronix’s extensive knowledge and experience in the electronics manufacturing industry make them the perfect partner to help us expand our reach and support our customers in North Dakota, South Dakota, Minnesota, Iowa, Wisconsin, and Illinois,” commented Isaiah Smith, Regional Sales Manager at BTU International.

E-Tronix will be responsible for promoting and selling BTU International’s thermal processing equipment. Their team of experts will also provide localized technical support and service, ensuring that BTU’s customers receive the highest level of support and expertise.

“By aligning ourselves with best-in-class suppliers and limiting our line card with nothing but the highest of quality products and technologies, we believe we can deliver solutions that enable our customers long-term sustainable success,” said Anthony Noto, Managing Partner of Illinois at E-Tronix. “We believe that BTU checks every box when it comes to having superior products, a reliable service network and a winning culture. While adding a reflow oven provider to our product offering has been on our radar for quite some time, we were simply waiting for the best in the market to become available, and that’s what we have with BTU.”

For more information about BTU International and its products, please visit www.btu.com. For inquiries and support in North Dakota, South Dakota, Minnesota, Iowa, Wisconsin and Illinois, please visit E-Tronix at www.E-Tronix.com.

MOUNT PLEASANT, PA – Intervala LLC, a premier full-service electronics manufacturing services provider, today announced that Florin Larion, an accomplished lean and continuous improvement leader, has been named corporate director of operational excellence. In this role, Florin is responsible for advancing a culture of continuous improvement throughout Intervala’s business and using Lean methodologies and tools to achieve companywide process-related improvements and strategic objectives.

Florin joined Intervala from AR RF/Microwave Instrumentation, bringing nearly 20 years of Lean practitioner experience within the global manufacturing arena. He previously held continuous improvement management roles and led Lean initiatives for Knoll Inc., Sterlite Technologies Ltd., NCR Corporation, Flextronics International Ltd., Corning Cable Systems, and Danaher Corporation, among other U.S.-based and global manufacturers. Florin holds a master’s degree in mechanical engineering from the Polytechnic Institute of Cluj and is a Lean Six Sigma master black belt, certified DMAIC Six Sigma black belt and recognized kaizen sensei.

“Our unrelenting commitment to operational excellence is a key element of Intervala’s culture and promise to always provide our customers with the smartest solutions to achieve their organizational goals,” said Teresa Huber, president and CEO. “We are excited to welcome another high-caliber professional such as Florin to the Intervala team and look forward to him applying his extensive lean and continuous improvement expertise to further facilitate companywide process-related improvements and strategic objectives for the benefit of our customers.”

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs." The webinar will take place on July 18, 2024, at 2:00 PM EDT.

Join us for an insightful session led by Sr. Applications Engineer Ravi Parthasarathy as he delves into the advancements in heterogeneous integration in semiconductor technology. This webinar will explore the transition from chip-on-substrate (CoS) to chip-on-wafer (CoW) technology, highlighting the integration of chips onto an interposer with wafer-level molding and flip chip (FC) substrate connection.

Ravi will share his extensive research originally presented at the IMAPS Device Packaging Conference, focusing on ultra-fine pitch CoW devices with bump pitches under 25μm and over 150K bump counts. Attendees will gain valuable insights into the efficacy of low-concentration alkaline cleaning agents compared to de-ionized water inline systems. Additionally, the webinar will cover the impact of wash temperatures and conveyor belt speed on cleaning effectiveness, utilizing visual inspection, FTIR analysis, and SEM/EDX testing.

This webinar is a must-attend for professionals seeking to enhance their understanding of heterogeneous integration and advanced cleaning techniques in semiconductor technology. Don’t miss this opportunity to learn from an industry expert and stay ahead of the curve in high-density advanced packaging.

For more information and to register for the webinar, please visit the Webinar Registration Page.