MIRTEC to Showcase Advanced 3D Inspection Systems at the 2025 IPC APEX EXPO
OXFORD, CT – MIRTEC, the ‘Global Leader in Inspection Technology’, is proud to announce its participation in the 2025 IPC APEX EXPO. The premier event for the electronics manufacturing industry will be held from March 18-20, 2025, at the Anaheim Convention Center.
At the 2025 IPC APEX EXPO, MIRTEC will unveil its complete line of 3D AOI and SPI Inspection Systems, including four major innovative systems designed to meet the rigorous inspection demands of the Automotive Electronics Industry at booth #2642. These systems incorporate state-of-the- art technologies that set a new standard in inspection precision and reliability.
ART 3D AOI System: Redefining Reflective Surface Inspection
ART, the world’s first 75MP Multi-Camera / Full HD 12 Projection 3D AOI system, delivers unparalleled precision in inspecting reflective surfaces like solder joints. Equipped with five 15MP CoaXPress cameras and Full-HD Digital Blue Moiré Technology, the ART employs advanced Anti-Reflection Technology to overcome the challenges posed by light saturation and complex reflective surfaces. This allows for accurate height and shape restoration, even when conventional AOI systems fail.
The cameras work in tandem, ensuring reliable inspection results by compensating for image gaps caused by reflection or light saturation. This approach is extended to its projectors, offering consistent and superior 3D inspection capabilities. The ART system is uniquely capable of inspecting reflective solder joints and other challenging surfaces, making it indispensable for high-end electronics manufacturers in automotive and aerospace sectors.
TAL 3D SCAN: Elevating Pre-Inspection Efficiency
The TAL 3D SCAN is a specialized pre-inspection system paired with the MV-6 OMNI AOI System. It sets a new standard by inspecting components up to 70mm tall without requiring Z-axis movement, a significant advantage over conventional systems that compromise speed for height measurements.
This innovative system offers uninterrupted inspection speeds and delivers an approximate 30% productivity boost for THT-SMT mixed PCB inspections. Its ability to handle taller components with precision makes it a critical tool for manufacturers aiming to enhance throughput without sacrificing accuracy.
GENESYS-CC: The Benchmark in Conformal Coating Inspection
The GENESYS-CC AOI system is optimized for conformal coating inspections, featuring a 15MP camera, a 15µm lens, and a 10- phase coaxial color lighting system with three UV-enabled stages. These components provide unmatched accuracy and speed, ensuring reliable detection of defects across a wide range of coating materials, including acrylic and silicone.
Optional upgrades include a 4µm lens for detecting bubbles as small as 60µm, addressing a key challenge in conformal coating inspections. Additionally, the side camera enhances the inspection of lateral coatings, improving overall defect coverage. With its internal flipper conveyor enabling double-sided PCB inspections, GENESYS-CC offers exceptional versatility and efficiency.
MV-3 OMNI: Advanced Benchtop AOI System
The MV-3 OMNI Benchtop AOI System incorporates the same cutting-edge technology as MIRTEC’s in-line systems, ensuring compatibility across the entire product line. It combines 15MP CoaXPress Camera Technology with Digital Tri-Frequency Moiré Technology to provide precise 3D inspections for defects like lifted leads and insufficient solder.
The upgraded version of MV-3 OMNI expands its inspection capabilities with a top clearance of 70mm and a bottom clearance of 100mm, accommodating high and low-profile components in mixed PCBs. Enhanced safety features and user-friendly design make it particularly suited for automotive and defense applications. The MV-3 OMNI is recognized as the most technologically advanced benchtop AOI system available.
Discover why MIRTEC is the global leader in inspection technology. Visit Booth #2642 during the 2025 IPC APEX EXPO to experience firsthand the innovations driving the future of electronics manufacturing.
