Press Releases
BANGALORE – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region. The event will be held from September 11 to 13, 2024, at the India Expo Centre in Greater Noida, India.
As the demand for higher quality and precision in electronic assembly continues to grow, the demand for advanced inspection technologies has become more critical than ever. With its wide range of high-speed, high-precision inline automated inspection solutions that help manufacturers reduce costs, streamline processes, and enhance production quality, Saki is leading this transformative change in the industry.
At productronica India 2024, Saki will be showcasing its total inspection solutions at Booth H014.A011. Visitors will witness live demonstrations of the latest 2D/3D Automated Optical Inspection (AOI) systems, alongside advanced X-ray Inspection (AXI) and Solder Paste Inspection (SPI) equipment presentations. Saki’s state-of-the-art software systems with enhanced programming features that further boost inspection accuracy and efficiency will also be a key highlight. In addition, Saki’s M2M (machine-to-machine) solutions designed to optimize quality and productivity across the entire production line will be demonstrated in collaboration with selected pick-and-place machines from partner SMT companies.
The show line-up on booth H014.A011 will feature:
3D-AOI
The industry’s most powerful inspection capability will be demonstrated by Saki’s 3D-AOI machine model 3Di-LS2, which is equipped with the innovative Z-axis control head and offers a height measurement range of up to 40mm in 3D mode. It also raises the focus height to 40mm in 2D mode. These unique capabilities enable Saki’s 3Di-AOI series to accurately, quickly and easily perform inspection tasks with significantly greater flexibility and precision than standard SMT inspection processes.
Software Solutions
Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor / MPV), and SPC/Process Quality and Traceability Tool (QD Analyzer).
"Saki will offer booth visitors an up-close and personal look at the unique features of the latest hardware and software releases with an emphasis on total inspection line solutions that deliver reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets. We look forward to welcoming visitors to our booth H014.A011 at productronica India 2024. Join us to explore how our latest innovations can support your manufacturing processes and elevate your production quality," said Anusorn Wiriyapongpibool, Technical Sales Manager Saki Asia Pacific.
For more information about Saki visit www.sakicorp.com/en/
CARLSBAD, CA – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.
Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.
DALLAS – CalcuQuote, a leading supply chain solutions provider for the electronics industry, is excited to announce its integration with Texas Instruments' (TI) complete Backlog API suite. Customers using the API can schedule deliveries, change purchase orders, receive advanced ship notices, and more. Ever ready to support customers, CalcuQuote’s purchasing platform seamlessly integrates with the Backlog API suite and is ready to integrate with any ERP API. This offers significant operational efficiencies and potential cost savings for all participants.
“We've observed a growing demand from our customers to incorporate sophisticated supply chain capabilities like those of the TI Backlog API,” said David Sharp, CEO at CalcuQuote.
“CalcuQuote’s unique expertise positions us to lead the way on all value-added integrations like we have with dozens of global suppliers.”
CalcuQuote offers comprehensive, out-of-the-box support for TI's Backlog API suite. This allows clients to place backlog orders with multiple scheduled releases, monitor order status, update existing orders, and more —all directly within the CalcuQuote procurement platform.
While CalcuQuote customers already benefit from access to pricing from global suppliers and the ability to place orders within a single, streamlined platform, this new integration offers an additional option for managing their procurement of TI components.
As the electronics industry increasingly embraces digital transformation and automation, CalcuQuote continues to lead the way in driving greater efficiency and innovation across manufacturers' supply chains.
SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is proud to emphasize its commitment to the highest quality standards through its continued compliance with ITAR (International Traffic in Arms Regulations) and J-STD-001 Space and Military Addendum certifications. Green Circuits is dedicated to delivering exceptional products and services to the aerospace, defense and other high-reliability sectors.
The ITAR certification ensures that Green Circuits complies with U.S. regulations on the export and handling of defense-related materials and technologies. This certification positions the company as a trusted partner for defense contractors and other organizations requiring stringent controls on sensitive information and products.
The J-STD-001 Space and Military Addendum certification reflects Green Circuits' expertise in meeting the rigorous requirements for soldered electrical and electronic assemblies in space and military applications. This certification is a testament to the company’s ability to produce reliable, high-quality products that meet the critical standards demanded by these industries.
"As we continue to serve the defense and aerospace markets, our ITAR and J-STD-001 Space and Military Addendum certifications play a crucial role in demonstrating our pledge to quality and security," said Michael W. Hinshaw, Jr., Chief Executive Officer of Green Circuits. "These certifications not only validate our processes but also assure our customers that they can rely on us for their most sensitive and mission-critical projects."
For more information, visit www.greencircuits.com
CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is proud to announce the expansion of its microelectronics clean room and assembly line. This strategic move relocates these operations adjacent to the PCBA SMT assembly area, enabling NEOTech to more efficiently automate production and better meet the growing demand for mixed PCBA and microelectronics assembly.
NEOTech, already recognized as an industry leader in SMT electronics manufacturing, stands at the forefront of high-tech microelectronics assembly. This expansion represents a significant investment of time, effort, and innovation, allowing NEOTech to stand apart from its competition. Few competitors have the high-speed automated assembly equipment required to achieve true mixed electronics assembly manufacturing. This key manufacturing differentiator means that NEOTech can seamlessly place chip-and-wire electronics side-by-side with SMT components on traditional PCBA assemblies — a capability that few in the industry can match.
“We are pleased to have made this investment, enabling NEOTech to meet the industry’s demand for low-cost microelectronics through our automated, mixed electronics manufacturing,” said Jim Doyle, Chief Executive Officer of NEOTech’s Aerospace & Defense Business. “At NEOTech, we are always actively engaged with our customers to fully understand their manufacturing needs and are committed to continuous internal improvements that ultimately enhance quality, boost efficiency, and reduce costs. I am incredibly proud of both our Microelectronics and SMT teams for their dedication in identifying this improvement and successfully implementing it. This advancement allows us to continue providing creative solutions to meet our customers’ unique product requirements.”
NEOTech stands out for its extensive capabilities and exceptional service offerings, catering to diverse industries including aerospace/defense, medical devices, industrial, and high-tech sectors. With a focus on delivering high-quality products and solutions, NEOTech has established itself as a trusted partner for complex and mission-critical electronic manufacturing needs.
The company’s state-of-the-art facilities and advanced manufacturing technologies ensure precision and reliability in every product delivered. NEOTech’s robust quality management systems, including ISO 9001:2015, ISO 13485:2016, and AS9100 certifications, reflect its commitment to delivering the highest quality.
NEOTech’s customer-centric approach is a cornerstone of its success. The company’s comprehensive range of services, from design and prototyping to production and after-market support, is tailored to meet the unique requirements of each customer. NEOTech’s ability to provide customized solutions, coupled with its focus on reducing time-to-market and optimizing costs, has earned it a reputation for delivering exceptional value.
With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics
CLINTON, NY – As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.
Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.
The GalliTHERM® portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- High thermal conductivity for end-product longevity and reliability
- Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
- Extraordinary wetting ability on both metallic and non-metallic surfaces
To learn more about how Indium Corporation’s HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.
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