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AUSTIN, TX – Austin American Technology (AAT) is pleased to announce the successful installation of its new X-40A 4.0 stencil cleaner at Jabil Inc. in San Jose. This installation marks the debut of the X-40A 4.0 version, featuring advanced I/O link devices and controls, simplified electrical composition, and smart notifications from components. These enhancements have been integrated into the most reliable and largest installed base fully automatic stencil cleaner on the market.

"We are thrilled to partner with Jabil on the installation of our latest X-40A 4.0 stencil cleaner," said Todd Rountree, CEO at Austin American Technology. "This new version represents a significant advancement in cleaning technology, offering improved efficiency, reliability, and performance. We are confident that the X-40A 4.0 will provide Jabil with the capabilities they need to maintain high-quality production standards."

The X-40A 4.0 stencil cleaner from Austin American Technology is designed to deliver superior cleaning results for stencil and misprinted PCB assemblies. With its innovative features and cutting-edge technology, the X-40A 4.0 ensures thorough and efficient cleaning, helping manufacturers achieve optimal production outcomes.

"We are impressed with the performance and capabilities of the X-40A 4.0 stencil cleaner from Austin American Technology," said Leven Hui, Manufacturing Engineer at Jabil San Jose. "This state-of-the-art equipment enhances our cleaning processes and contributes to the overall efficiency of our operations. We look forward to continued collaboration with Austin American Technology to drive success in our manufacturing endeavors."

Jabil (NYSE: JBL) is proud to be a trusted partner for the world's top brands, offering comprehensive engineering, manufacturing, and supply chain solutions. With more than 50 years of experience across industries and a vast network of over 100 sites worldwide, Jabil combines global reach with local expertise to deliver both scalable and customized solutions. The company’s commitment extends beyond business success as they strive to build sustainable processes that minimize environmental impact and foster vibrant and diverse communities around the globe. Discover more at www.jabil.com 

For more information about Austin American Technology, please visit www.aat-corp.com 

LANDSHUT, GERMANY – Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging Production Line exhibition at SMTconnect, June 11-13, in Nuremberg, Germany. Celebrating its 30th anniversary in 2024, Solder Chemistry is committed to maintaining its flexible, customer-oriented structure to deliver the same quality, innovation, and customer satisfaction for which it has become renowned.

Organized by the Fraunhofer IZM, the live production line is an industry-renowned collaboration among various equipment manufacturers, material providers, component suppliers, and research institutes. Inaugurated in 1997, the 26th edition of the joint effort will examine how a higher degree of digitalization and automation can make production processes more robust and responsive to disruptions and external influences.

The exhibition provides visitors with an invaluable opportunity to find customizable solutions for their unique production challenges. In addition to one-on-one discussions, technology breakfasts, and consultation hours, line tours are offered three times daily in both English and German throughout the show.

Solder Chemistry’s BLF083, a lead-free, no-clean paste designed for excellent soldering results with a wide range of process conditions, will be featured on the Future Packaging production line. BLF083 offers outstanding low-voiding, slump, and solder beading resistance, as well as high-temperature stability, long-term processing and standing time. BLF083 paste delivers:

  • Low-voiding performance
  • Excellent low-to medium-speed printing
  • High tackiness
  • Good response-to-pause
  • Low beading
  • Clear residue
  • Easy cleanability

“It is an honor for Solder Chemistry’s BLF083 to be featured on the Fraunhofer line at SMTconnect,” said Werner Wagner, General Manager Indium Advanced Materials GmbH.

“The line is a highlight of the show and provides an invaluable opportunity for attendees to interact with cutting-edge manufacturing processes and technologies in a simulated real-world environment.”

SANTA CLARA, CA ― Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, is proud to offer world-class expertise in BGA (Ball Grid Array) assembly, setting new standards for quality, speed and flexibility in the industry.

Operating from a cutting-edge 4.0 closed-loop system facility in the heart of Silicon Valley, Absolute EMS boasts SMT lines running at an astounding speed of 80,000 placements per hour, surpassing the industry average of 20,000-40,000 placements per hour.

"At Absolute EMS, we leverage the industry's most sophisticated equipment to create a flexible manufacturing environment tailored to our customers' needs," said Doug Dow, COO of Absolute EMS. "Our state-of-the-art facility enables us to deliver high-volume manufacturing services with unmatched precision and efficiency, all while maintaining globally competitive prices."

Absolute EMS offers an extensive array of BGA assembly capabilities tailored to meet the rigorous demands of modern electronics manufacturing. These include a touchless manufacturing line equipped with automated quality checks for prototypes and production runs, the handling of micro components as small as 0.2 mm x 0.1 mm (008004 Imperial Code), in-line 3D solder paste inspection, and automatic optical inspection.

Additionally, Absolute EMS utilizes 3D X-ray technology for comprehensive inspection of complex assemblies and ensures automated date code and lot code traceability from purchase order through product shipment. With expertise in fine pitch and high count BGAs, fiber optics, RF microelectronics, and press fit connectors, along with hybrid processes supporting both tin- lead and lead-free soldering techniques, Absolute EMS delivers quick turn prototype assembly and conformal coating services. Moreover, they excel in the assembly of rigid and flexible boards with tight tolerance requirements, backed by built-in quality systems for the highest level of product reliability.

"Our commitment to excellence is reflected in every aspect of our BGA assembly process, with all vision system tests set to view the smallest common denominator of 008004 componentry," added Dow. "At Absolute EMS, we are dedicated to pushing the boundaries of what's possible in electronic manufacturing, providing our customers with the highest quality solutions tailored to their specific needs."

For more information about Absolute EMS and its comprehensive electronics manufacturing services, visit www.absolute-ems.com 

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is excited to announce its participation in the upcoming PB Technik event in Warsaw, Poland. Hosted by PB Technik, a renowned distributor of professional production lines for the electronics industry, the event will take place May 22-23, 2024 at the Boss Hotel.

During the exhibition, Pieter Van Der Vorst, PVA Europe Sales Manager, will be in attendance to showcase the latest advancements in coating technology. Van Der Vorst will present the Delta 8, a cutting-edge 4-axis coating machine equipped with state-of-the-art features.

The Delta 8 boasts a comprehensive set of capabilities, including compatibility with the FC100-CF Film Coating Valve, FCS300-ES Spray Valve, and FCM100 Micro Dispense Valve. Its continuous film calibration functionality, combined with the new PathMaster X software, ensures unparalleled precision and reliability in coating applications.

"We are excited to participate in the PB Technik event and showcase our advanced coating solutions," said Pieter Van Der Vorst. "At PVA, we are dedicated to pushing the boundaries of technology to provide our customers with the most efficient and effective coating processes. We look forward to engaging with attendees and demonstrating how our solutions can drive success in their operations."

PB Technik's event series, "PB Technik Meets Friends," serves as a platform for industry professionals to explore the latest technologies, exchange insights, and foster collaborations. The 6th edition of the event, coinciding with PB Technik's 25th anniversary, promises an enriching experience with informative presentations and a comprehensive exhibition of cutting-edge electronics manufacturing solutions.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

REDDITCH, UK – Danutek, a leading supplier of capital equipment and service support to the electronics manufacturing sector in Europe, proudly marks its 20th anniversary this year. To commemorate this significant milestone, members of the Danutek team attended the InnoElectro event in Budapest, Hungary, one of the region's most prominent gatherings for the electronics manufacturing industry.

Over the past two decades, Danutek has established a strong presence in 10 countries, becoming a trusted partner for over 300 customers and successfully installing more than 3,000 machines. This impressive growth is a testament to the company’s commitment to innovation and exceptional customer service.

At InnoElectro 2024, Danutek Kft. showcased a comprehensive range of equipment for the electronics industry. Highlights included Scienscope smart racks and goods-in scanning tables, Techvalley X-ray component counters, Koh Young's SPI, AOI, and conformal coating inspection systems, and the Axonn Mycronic conformal coating unit. These cutting-edge technologies reflect Danutek’s dedication to providing advanced solutions to its customers.

Richard Booth, CEO of Danutek, said: "It really is amazing to step back and look at the progression of Danutek and our organisation. I am incredibly proud of the local team and what they have been able to achieve.

“Danutek is one of the most successful organisations in their respective regions, and we have supported a terrific number of customers and successful projects over those years. I would like to think we've made a very positive impact on electronics manufacturing in the region with our support and dedication. Here's to another 20 years of success and innovations!"

As Danutek looks ahead, the company remains steadfast in its mission to support and contribute to the growth of the electronics manufacturing industry in Europe.

CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and drive green technologies of tomorrow, such as e-Mobility. These proven materials have also been shown to solve customers’ warpage issues while ensuring high reliability and improving overall efficiency.

Among its featured products, Indium Corporation will showcase:

  • Durafuse® HT – an innovative Pb-free solution based on a novel alloy technology designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
  • Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents delamination and warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
  • QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
    • InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
    • InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
    • InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #466.

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