SAN JOSE, CA – SHENMAO America, Inc. is proud to announce that its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure) certification for recycled content. This prestigious validation now includes auditing of social responsibility procedures.
Under its vision of becoming a resource-saving and environmentally friendly global leader in solder manufacturing, SHENMAO has prioritized recycling tin alloy as a core strategy in developing solder products and green energy solutions. This initiative not only enhances the company’s competitiveness but also reduces its carbon footprint and deepens its ESG (Environmental, Social, and Governance) efforts.
As part of its sustainability mission, SHENMAO has implemented resource recycling and waste management policies that align with national regulations and industry best practices. By integrating internal systems and urging group companies to optimize waste treatment, the company actively reduces environmental pollution risks while maximizing resource efficiency.
A series of SHENMAO’s solder materials—including Solder Paste, Solder Bar, Solder Wire, and BGA Solder Sphere—have successfully achieved UL validation for recycled content. These products contain a minimum of 80% recycled content, with the tin alloy sourced entirely from 100% recycled materials.
To ensure transparency and reliability, every step in SHENMAO’s recycling process undergoes rigorous auditing. The company has also made technical breakthroughs to ensure that the quality and performance of its recycled solder materials meet or exceed the standards of virgin materials. By controlling impurities in recycled tin alloy, SHENMAO guarantees that these materials perform at industry-leading levels with no significant difference from those made with virgin tin.
As the adoption of recycled tin continues to rise, SHENMAO is seeing growing market acceptance of its sustainable solder solutions. By prioritizing innovation, sustainability, and social responsibility, SHENMAO is setting a new standard for environmentally friendly manufacturing in the electronics industry.
For more information about SHENMAO’s sustainable solder solutions, visit www.SHENMAO.com
BLAUBEUREN, GERMANY – Since 2002, productronica in China has been one of the most important events in Asia. This year, the trade fair once again offers the opportunity to exchange ideas with international experts, attend specialised lectures, make business contacts and find out about the latest innovations across the entire electronics production value chain. Rehm Thermal Systems will also be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
In an increasingly competitive environment, electronics manufacturers must continuously adapt and improve their processes to remain competitive: the growing demand for reliable and powerful electronics means that durable and stable solder connections are becoming increasingly important. In addition, production costs are rising significantly due to higher prices for raw materials or electricity, so companies are constantly looking for ways to optimise costs.
Rehm Thermal Systems has responded to these developments and driven forward the further development of systems in areas such as convection soldering, condensation soldering, coating and dispensing: at booth E4.4518, the Rehm experts will be demonstrating the wide range of applications for the dispensing and coating system live at the Protecto.
They will also be providing information on convection soldering under vacuum with the VisionXP+ Vac for greater process reliability and on more economical vapour phase soldering with the Condenso Series thanks to the integrated closed-loop system.
High-quality Convection Soldering with the VisionXP+ Vac
Vacuum soldering has proven to be particularly suitable for high-quality solder joints with very few voids: with the VisionXP+ Vac convection soldering system from Rehm Thermal Systems, pores, gas inclusions and voids can be reliably removed directly after the soldering process while the solder is still in an optimally melted state. Time-consuming post-processing of the assemblies using an external vacuum system is therefore no longer necessary. The VisionXP+ Vac is not only characterized by high process stability, but it also impresses with reduced operating costs thanks to the switch to EC motors (energy savings of around 30 percent).
Resource-saving Vapour Phase Soldering with the Condenso Series
With the closed-loop system for lower production costs thanks to lower Galden® consumption, minimal maintenance and fewer production errors, Rehm Thermal Systems has found a future-proof solution for more economical vapour phase soldering: after soldering, the vacuum and/or cooling process starts. At the same time, the process gas is extracted and purified. A vacuum is created during extraction, which guarantees rapid drying of the solder and process chamber, thus minimising losses when the products are discharged. The extracted Galden® is filtered and cleaned of impurities using granules. This allows approx. 99.9 percent of the medium to be recovered. The purified liquid is stored in a container at room temperature and made available for further processes. This means that no evaporation and energy losses occur. The hermetic sealing of the process chamber (also a vacuum chamber) also prevents evaporation losses during soldering.
Flexible Coating and Dispensing Options with the Protecto Series
Conformal coating has become an integral part of modern manufacturing, as the protective coating is used to reliably protect electronic assemblies from aggressive environmental influences. With the Protecto Series, Rehm Thermal Systems offers you the opportunity to react quickly to market changes and individual customer requirements thanks to a wide range of possible applications: this system is not only used for automated coating, but also for bonding, sealing and fixing. In addition, up to four different materials can be applied directly "on the fly" using the various applicators.
The systems can be operated using the ViCON software, which fulfils all the requirements of modern, networked and, above all, future-oriented electronics production: the ViCON combines tried-and-tested software tools, such as clear product management and process locking, with new possibilities in mobile applications in the form of the ViCON App and ViCON Connect – in an attractive design and with intuitive touch operation.
We look forward to your visit and the opportunity to talk to you personally about the individual challenges of your manufacturing or production and to answer your questions.
INDIANAPOLIS, IN – Specialty Coating Systems (SCS) is proud to announce that its Singapore facility has achieved Nadcap ® accreditation for conformal coating of electronics – printed board assemblies. The accreditation highlights SCS’ dedication to upholding the highest standards of quality and reliability in the aerospace and defense industries.
Nadcap (National Aerospace and Defense Contractors Accreditation Program) is a globally recognized program that establishes rigorous standards and conducts in-depth audits to ensure compliance and excellence in critical industry processes. Achieving Nadcap accreditation involves a meticulous evaluation of a company’s capabilities, quality management systems and adherence to industry best practices.
The SCS facility in Singapore underwent a comprehensive assessment by Nadcap auditors, who thoroughly evaluated the facility’s processes, equipment, training, and documentation related to the conformal coating of electronics – printed board assemblies. The successful accreditation highlights the site’s expertise, operational excellence and dedication to providing exceptional conformal coating services to its global customers.
“This Nadcap accreditation is a testament to the hard work and expertise of our Singapore team,” said SCS President and CEO Tim Bender. “It also reflects our company’s ongoing commitment to meeting and exceeding our customers’ stringent quality requirements and strengthens the trust our aerospace and defense customers place in us to protect their most critical technologies.”
Specialty Coating Systems is known worldwide for its advanced conformal coating solutions, serving industries such as aerospace, medical devices, electronics, transportation and defense. With over 50 years of experience, SCS is dedicated to supporting its customers’ successes through innovative, high-quality solutions and a commitment to excellence.
For more information about SCS, please visit www.scscoatings.com
REDDITCH, UK – Altus Group, a leading distributor of capital equipment in the UK and Ireland, has concluded another successful year at Southern Manufacturing and Electronics 2025, where the team strengthened relationships with existing customers and engaged with new industry contacts. The event provided an ideal platform to showcase some of the leading-edge solutions in electronics manufacturing and discuss key projects set to shape the industry in 2025 and beyond.
This year, Altus highlighted four key machine processes from its portfolio, featuring advanced solutions from leading suppliers, including, Koh Young’s 3D Automated Optical Inspection (AOI), PVA’s Conformal Coating technology, Asscon’s Vapour Phase Soldering, and Essemtec’s All-in-One SMT Assembly system. Interest was particularly strong in conformal coating and modular SMT assembly, reinforcing a trend that has carried over from 2024.
Joe Booth, CEO of Altus Group said: “I'm always delighted after the Southern show as our stand becomes increasingly busy each year. My only disappointment is missing customers who wanted to connect with us because our team was already engaged in discussions.
“Ultimately, this event is great for catching up with numerous customers in one place and establishing a clear focus on priority projects where we can deliver the greatest value. Our close customers conveyed genuine excitement about the year ahead and emerging stability, further boosted by the promising outlook of declining interest rates, which should support increased investment in their facilities. I'm eager to see this interest translate into technical validations and successful implementations throughout the year."
Altus met with over 100 different UK manufacturing sites across the three-day event, discussing hundreds of live projects slated for 2025 and 2026. This high level of engagement demonstrates the ongoing opportunities within electronics manufacturing and positions the company for another strong year ahead.
A highlight of the show was Joe Booth’s presentation, Every Challenge is an Opportunity with the Right Vision, which explored how manufacturers can turn economic pressures into opportunities for innovation. The session reflected on key projects implemented by Altus in 2024 and provided insights into leveraging automation and advanced manufacturing solutions to navigate market challenges.
For more information about Altus Group and its portfolio of advanced manufacturing solutions, visit www.altusgroup.co.uk
NEW ALBANY, IN – Samtec, Inc., the service leader in the connector industry, has announced that it has signed TTI, Inc. as an authorized distributor of the full line of Samtec cable and connector products. TTI, Inc. is a leading specialty distributor of interconnect, passive, electromechanical components, and discrete semiconductors. With this new agreement, TTI will provide Samtec PCB interconnects to electronics manufacturers worldwide, simplifying customers’ BOM purchases.
TTI, Inc. is a world-leading authorized distributor and specialist in electronic components, offering inventory from hundreds of the world's leading manufacturers. With more than 136 locations, over 8,000 employees, and more than 3 million square feet of warehouse worldwide, TTI’s extensive product line and supply chain solutions have made it the distributor of choice for industrial, military, aerospace and consumer electronics manufacturers.
“At Samtec, Sudden Service® drives everything we do, from developing flexible, high-performance interconnect solutions, to selecting our distribution partners” says Rick Skees, VP of Distribution, Samtec,. “TTI is known throughout the industry as a leader in customer support with a commitment to quality and inventory management. We are very pleased that they will be representing Samtec products in the global distribution channel.”
From standard products to unique high-performance designs, Samtec’s interconnect solutions are designed to support any interconnectivity need, regardless of application, performance requirements or environment. Serving digital, RF, and optical designs, Samtec’s products can be found in electronic products used in many applications, including datacom, AI/ML, military/aerospace, industrial, medical, test, computer/semiconductor, automotive, and consumer.
“We are very pleased to add Samtec to our supplier line card,” says Lew LaFornara, SVP Product and Supplier Marketing. “We look forward to bringing Samtec’s industry-leading connector, cable and fiber optic products to our global customers, many of whom look to TTI and our custom supply chain management programs to minimize supply chain risk, reduce their inventories, and streamline their purchasing processes.”
The full line of Samtec products will be available from TTI beginning Q1 2025.
SEOUL, KOREA – Koh Young Technology has established a subsidiary in Taiwan, it announced on the 10th. The strategy aims to strengthen partnerships and technological competitiveness with local clients, including TSMC, the world's largest foundry.
Koh Young Technology, the global leader in surface mount technology (SMT) inspection equipment for semiconductors, has developed three-dimensional inspection equipment that significantly improves speed and precision. Major products include solder paste inspection equipment (SPI), automated optical inspection equipment (AOI), semiconductor packaging inspection equipment, and transparent material inspection equipment, among others. The company supplies products to over 3,600 clients worldwide, including TSMC and Taiwan's ASE, the number one company in semiconductor packaging.
Taiwan is the center of the global foundry industry. The Taiwanese government established the Industrial Technology Research Institute in 1973 for industrial development. TSMC, the representative semiconductor corporation, was spun off from the Industrial Technology Research Institute, and various corporations are positioned throughout the entire semiconductor production process, from foundry to fabless and back-end processing.
According to Bloomberg News, 90% of the world's most advanced semiconductors and chips are produced in Taiwan, and the American semiconductor company NVIDIA is also manufacturing AI chips in Taiwan.
George Hsu, head of Koh Young Technology's Taiwan subsidiary, said, "By leveraging Taiwan's geographical strengths as a core hub of the global semiconductor industry, we will promote technological innovation and focus on penetrating semiconductor clients. We have already started to attract interest from various semiconductor clients, receiving love calls from advanced process clients for chip-on-wafer-on-substrate (CoWoS)," he noted. He added, "We will expand our market share and strengthen our global influence in the semiconductor market through customized strategies and technological capabilities tailored to each market."
Meanwhile, Hsu is a semiconductor expert with about 30 years of experience having passed through global semiconductor equipment companies such as Applied Materials Taiwan and Onto Innovation. He plans to focus on acquiring new clients and enhancing sales capabilities based on his experience in sales strategy.