MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum. The event will occur on September 11th and 12th, 2024, at the Expo Guadalajara, Salón Jalisco Hall D & E, in Guadalajara, Jalisco, Mexico.

ZESTRON will be exhibiting at Booth #922, where our team of experts will be available to discuss our wide range of cleaning solutions and answer any questions regarding our popular decoating product, ATRON® DC. This product is known for its exceptional and efficient performance when removing conformal coating residues from pallets, fixtures, and tools. Specifically designed as a safe alternative to the harsh cleaners used in the past, this water-based product reliably removes acrylic, urethane, epoxy, and some silicone conformal coatings and can be used in all types of maintenance cleaning equipment, such as dip tanks and ultrasonic processes.

Why Visit ZESTRON at Booth #922?

• Expert Guidance: Meet our team of specialists ready to provide insights into our full suite of cleaning solutions, including the ATRON® DC.
• Customized Support: Discover how ZESTRON’s Technical Center can be used as an extension of your team.

From process optimization to qualifications and compatibility testing, ZESTRON can enhance the reliability and performance of your electronics manufacturing processes. ZESTRON is committed to delivering innovative cleaning solutions that meet the highest quality and performance standards. We invite all attendees to visit us at Booth #922 to learn more about how ZESTRON can help optimize your manufacturing processes.

MINNEAPOLIS, MN – Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and metrology solutions, including the Quadra 7 Pro Manual X-ray Inspection (MXI) System, the new SpinSAM Acoustic Micro Imaging (AMI) system and the Gen 7 AMI system. The company will also demonstrate the WaferSense® Auto Teaching System™ (ATS2) for semiconductor tool set-up and maintenance.

The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.

Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.

Enhancing the Quadra 7 Pro's capabilities is the newly developed Revalution™ software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution™ software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.

The new SpinSAM AMI system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with the best-in-class defect capture and image quality.

With 4 matched waterfall transducers in a compact footprint, the system was meticulously engineered to attain full wafer scans in less than 6 minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.

The WaferSense® Auto Teaching System™ (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum™ software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.

Nordson is a platinum sponsor of Semicon Taiwan and will be delivering a presentation titled ‘Revolutionary Acoustic Technology for Wafer-Level Applications’ at the Heterogeneous Integration Global Summit on Thursday, September 5th at 11:50am local time at 701GH, 7F, Taipei Nangang Exhibition Center Hall 2.

For more information, visit www.nordson.com 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Empire Expo & Tech Forum taking place on September 26 at the DoubleTree by Hilton Syracuse in East Syracuse, New York. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Empire Expo & Tech Forum on September 26th, or visit www.aimsolder.com

CLINTON, NY – Indium Corporation Junior Application Engineer Siegfried Lorenz will present as part of Delsys Tech Day on Wednesday, September 11, in Lucerne, Switzerland.

Lorenz will join nine other industry experts to share insights on forward-looking manufacturing trends within the electronics assembly sector. His presentation will showcase an innovative alloy system designed for high-reliability applications.

The presentation’s focus, Durafuse® HR, is a new high-reliability alloy used for solder paste, developed from the company’s Durafuse® mixed-alloy technology. It delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications. Engineered to withstand 3,000+ thermal cycles at -40°C/125°C across different PCB finishes and component types, Durafuse® HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys.

“No longer does high-reliability have to mean high voiding, as Durafuse® HR outperforms SAC305 when it comes to bottom-terminated component voiding while also reducing solder joint cracking and increasing shear strength,” said Lorenz.

As a Junior Application Engineer, Lorenz supports Indium Corporation’s customers across Germany, Austria, and Switzerland, offering engineering guidance and technical specifications. He also accelerates the sales process by providing expert technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.