ORLANDO, FL (January 5, 2026) – The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC 2026. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount.

Eligible participants currently enrolled in an undergraduate (BSc) / master’s (MSc) program, or doctoral (PhD) candidates from any university must pre-register by January 11, 2026 for one of the following three pre-defined challenges:

For BSc and MSc students

• Low-cost Robust Thermal Solution for High Power AI/Datacenter Processor

For PhD students

• Materials, Interfaces, & Processes for Ultra-Scalable Interconnects
• Electromigration Solutions for BGA Interconnects in AI-Focused Packages

On February 1, 2026, teams must submit a six-page report with their results and findings for the award and the organizing committee will announce up to six teams selected for the finalist round of the competition on February 28, 2026. These teams will have until May 15, 2026 to finalize their work and submit their presentations.

For more information about the student competition

Please visit: https://ectc.net/ectc-competition/

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