Indium WS-910 water-soluble flip-chip dipping flux is said to be compatible with molded and capillary underfill.

Offers high tackiness for a flip-chip flux, for holding large die in place during reflow, and minimizes non-wet open defects and cold joints. Promotes solderability onto a wide range of surfaces, and ensures consistent yields through consistent dipping performance over extended periods. Cleans with pure room-temperature deionized water. Is designed for Pb-free applications and suitable for all high-Sn solders. Compatible with a wide variety of conventional ultrafiltration and modified ultrafiltration

Indium Corporation

https://www.indium.com/products/fluxes/semiconductor-fluxes/flip-chip-flux

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