ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.

Everett Charles Technologies, www.ectinfo.com

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account