ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.

Everett Charles Technologies, www.ectinfo.com