ZIP contacts for semiconductor test feature planar contact surfaces produced by test pin manufacturing processes. The Z Interconnect Pin is available in three design configurations: radial, flat, and hybrid. Radial uses machined 3-D components; flat employs 2-D components, and hybrid combines both. Are designed for interchangeability in the same test tool. Available for 0.5, 0.8, and 1.0 mm test pitches with 1.27, 0.4, and 0.3 mm designs.