S3X-BF70M and 200N series wafer bumping pastes exhibit a high definition over time at elevated temperatures. S3X-BF70M series is for 250 μm bump sizes. Offers superior cleaning performance in a SAC 305 powder with a 20~38 μm diameter. S3X-BF200M is for 100 μm bump sizes with a SAC 305 powder and 5~20 μm diameter.

Ko-ki, www.ko-ki.co.jp