Koki Debuts S3X-BF70M, 200N Series Wafer Bumping Pastes
Published: 01 December 2010
S3X-BF70M and 200N series wafer bumping pastes exhibit a high definition over time at elevated temperatures. S3X-BF70M series is for 250 μm bump sizes. Offers superior cleaning performance in a SAC 305 powder with a 20~38 μm diameter. S3X-BF200M is for 100 μm bump sizes with a SAC 305 powder and 5~20 μm diameter.
Ko-ki, www.ko-ki.co.jp
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