NC722 low-melting SnBi solder paste is halide-free and rosin-based. For use with low-temperature alloys such as Sn42Bi58. Reportedly offers good open times, abandon time and soldering activity with all surface finishes. Meets or exceeds ANSI/J-STD -004, -005 requirements, as well as Bellcore test criteria. Features print volume consistency with surface area ratios as low as 0.55. Is suitable for high RH areas.

FCT Assembly, www.fctassembly.com