FCT Assembly Develops NC722 Solder Paste
Published: 22 April 2013
NC722 low-melting SnBi solder paste is halide-free and rosin-based. For use with low-temperature alloys such as Sn42Bi58. Reportedly offers good open times, abandon time and soldering activity with all surface finishes. Meets or exceeds ANSI/J-STD -004, -005 requirements, as well as Bellcore test criteria. Features print volume consistency with surface area ratios as low as 0.55. Is suitable for high RH areas.
FCT Assembly, www.fctassembly.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.