PowerSpector series includes four desktop and three inline AOI machines. FDAz inspection head is designed for post-reflow applications with objects invisible to systems with top-viewing cameras, such as J leaded components and QFNs; inspects SMT and THT component bodies for presence/absence, type, polarity, offset, text, colors, etc., and components solder fillets for excessive, insufficient, no solder, shorts, lifted leads, etc. Suitable for use in pre-reflow, post-reflow, post-wave and post-selective; can be used for 2D solder paste inspection and first article inspection. High-res top camera has telecentric lens and multiplexed 8x CameraLink side camera technology with Tilt-Shift lenses in 45/45° configuration; can choose between 10µ and 18.75µ per pixel lenses. Three light sources with different colors and from different angles create a profile of solder menisci, while the main light results in real color representation of components. Diffused On Axis Light (DOAL) projects 90⁰ on the target components. Motorized, vertical height-adjustable optical head compensates for PCB warpage and reportedly adapts to any PCB thickness.

MEK, www.mek-europe.com 

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