CA-102 conductive adhesive, for bonding components to circuit boards, has a moderate glass transition temperature (Tg) and modulus. Rheology is optimized for screen printing and can be needle-dispensed by time-pressure, auger or positive displacement. Provides conductivity stability during damp heat testing on tin, silver and copper surfaces. For requiring lower-stress, lower-temperature processing or Pb-free applications

Engineered Material Systems, www.emsadhesives.com

TAGS: conductive adhesive, Engineered Material Systems, SMT, electronics assembly, printed circuit board