caLogo

CA-102 conductive adhesive, for bonding components to circuit boards, has a moderate glass transition temperature (Tg) and modulus. Rheology is optimized for screen printing and can be needle-dispensed by time-pressure, auger or positive displacement. Provides conductivity stability during damp heat testing on tin, silver and copper surfaces. For requiring lower-stress, lower-temperature processing or Pb-free applications

Engineered Material Systems, www.emsadhesives.com

TAGS: conductive adhesive, Engineered Material Systems, SMT, electronics assembly, printed circuit board

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account