PQ10 low-temperature solder paste is made with Sn42Bi58 alloy and has melting point of 138°C.

Compared to SAC, it reportedly reduces peak reflow temperature; energy consumption; and warpage of PCB and components. Is paired with PF735 and PF743 alloys. Fine bismuth phase; good drop test performance; good thermal cycle test performance.

Shenmao
shenmao.com


Register now for PCB WEST, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account