PF735-PQ10 low-temperature solder paste is made with a modified SnBi alloy that has a melting point range from 137°~142°C to 137°~170°C.
Is for SMT devices. Offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components, as well as better ductility, finer microstructure, and increased drop and thermal reliability.
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