PF735-PQ10 low-temperature solder paste is made with a modified SnBi alloy that has a melting point range from 137°~142°C to 137°~170°C.

Is for SMT devices. Offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components, as well as better ductility, finer microstructure, and increased drop and thermal reliability.

Shenmao
shenmao.com

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account