Bergquist Gap Pad TGP 10000ULM thermal interface material was developed to address high-power density challenges associated with 5G telecom infrastructure and consumer mobility designs.

Provides thermal conductivity of 10.0 W/m-K within ultra-low modulus, low assembly stress formulation. Soft, high-compliance pad conforms to irregular surfaces, fills small gaps to enable interface wet-out and optimal thermal transfer. Filler technology and low modulus formulations unite high thermal conductivity with low assembly stress, minimizing component damage while offering heat removal from critical components.

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