Bergquist Gap Pad TGP 10000ULM thermal interface material was developed to address high-power density challenges associated with 5G telecom infrastructure and consumer mobility designs.

Provides thermal conductivity of 10.0 W/m-K within ultra-low modulus, low assembly stress formulation. Soft, high-compliance pad conforms to irregular surfaces, fills small gaps to enable interface wet-out and optimal thermal transfer. Filler technology and low modulus formulations unite high thermal conductivity with low assembly stress, minimizing component damage while offering heat removal from critical components.

Gap Pad TGP10000



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