MWS 2300 wave soldering system now has automatic nozzle height adjustment that does not influence cycle time.

Height of each solder nozzle can be adjusted via software within a distance of 20mm. All solder joints can be wetted. A component-specific-defined solder peel-off is enabled. Is linked to sector soldering feature, which allows program parameters for pump revolution speed (wave height) and conveyor speed individually for up to 16 PCB sectors.

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SEHO MWS2300 Nozzle Height Adjustment

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