Seho Upgrades MWS 2300 Wave Soldering System
Published: 28 January 2021
MWS 2300 wave soldering system now has automatic nozzle height adjustment that does not influence cycle time.
Height of each solder nozzle can be adjusted via software within a distance of 20mm. All solder joints can be wetted. A component-specific-defined solder peel-off is enabled. Is linked to sector soldering feature, which allows program parameters for pump revolution speed (wave height) and conveyor speed individually for up to 16 PCB sectors.
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