DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.

Reportedly have high thermal conductivity and can achieve thin bonding line thickness; have excellent bonding strength and thermal cycling performance. Can withstand extreme temp. (-273°C) without delamination. Can be used for die attach applications for harsh conditions and bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

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