Yincae Develops DA158N Die Attach Adhesives
Published: 30 March 2022
DA158N die attach thermal conductive and electrical insulating adhesives can be fast cured at low temp.
Reportedly have high thermal conductivity and can achieve thin bonding line thickness; have excellent bonding strength and thermal cycling performance. Can withstand extreme temp. (-273°C) without delamination. Can be used for die attach applications for harsh conditions and bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.
Yincae
yincae.com
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