V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.

Post-process residue is probed and possesses high SIR values required for high-reliability applications. Is REACH and RoHS compliant. Is available in SAC 305 T4.

AIM Solder
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