AIM Solder Introduces V9 Solder Paste
Published: 12 May 2022
V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.
Post-process residue is probed and possesses high SIR values required for high-reliability applications. Is REACH and RoHS compliant. Is available in SAC 305 T4.
AIM Solder
aimsolder.com
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