PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.
Can reduce reflow temp. to below 190°C. Reportedly reduces thermal stability requirement of PCBs and components. Is halogen-free and complies with RoHS 2.0 and REACH. Powder size ranges from type 5 to type 7 for fine dot jetting. Is suitable for fine-pitch and ultra-fine-pitch applications and devices with uneven, cavities and other difficult to print locations.
Shenmao America
shenmao.com