PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.

Can reduce reflow temp. to below 190°C. Reportedly reduces thermal stability requirement of PCBs and components. Is halogen-free and complies with RoHS 2.0 and REACH. Powder size ranges from type 5 to type 7 for fine dot jetting. Is suitable for fine-pitch and ultra-fine-pitch applications and devices with uneven, cavities and other difficult to print locations.

Shenmao America
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