Indium SiPaste C201HF combines non-wet open (NWO) performance with stencil print transfer efficiency to satisfy a range of process requirements and boost SPI yields.

Leaves a cleanable residue, able to be removed with a commercially available semiaqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.

Features transfer efficiency on fine feature apertures, with consistent process yields below 80μm. Delivers:

• Consistent and tight solder deposit spread across multiple prints; excellent response-to-pause performance
• Minimal voiding on tight-pitch components, ensuring joint strength on small components
• Excellent reflow performance on components that exhibit high warpage
• Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
• Flexible cleaning; can be used in processes that require cleaning with a saponifier or that do not require cleaning

Indium

indium.com