Indium SiPaste C201HF combines non-wet open (NWO) performance with stencil print transfer efficiency to satisfy a range of process requirements and boost SPI yields.
Leaves a cleanable residue, able to be removed with a commercially available semiaqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.
Features transfer efficiency on fine feature apertures, with consistent process yields below 80μm. Delivers:
Indium
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