AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.

Is said to be ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, and features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

AIM Solder

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