AIM Rolls Out NC259FPA Solder Paste
Published: 29 November 2023
AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.
Is said to be ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, and features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
AIM Solder
Press Releases
- ViTrox Americas Doubles Capacity at Demo Center in Hutto, Texas
- Absolute EMS Earns ITAR Registration, Strengthening Manufacturing Capabilities for Military and Defense OEM Customers
- The ICAPE Group Announces the Launch of Its E-Shop at Electronica
- ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology