Soldering excursions can lead to visual process indicators.

This month we look at cracks in plated through-holes around the knee of the hole. FIGURE 1 shows very small via holes that were subjected to multiple lead-free soldering steps, then underwent thermal cycling with no failures but a little cracking.

The cracks visible in the microsection were found on via holes not after the initial two reflow steps and wave-soldering test boards, but after further temperature cycling at -55^o +125^oC. No electrical failures were detected, just the impact of repeated stressing of the copper. It is a good demonstration of how reliable a board can be, but all that stress does have some visual impact. Care must be taken during microsection preparation to see these indicators.

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