EP3RR-80 one-component epoxy has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing. For bonding, sealing, potting and encapsulation applications, including flip chips. Is said to cure in 45 to 50 min. at 80°C (175°F), or in 25 to 30 min. at 250°F. Low exotherm while curing enables cure in thicker sections up to and beyond a 0.5" deep. Dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics. Thermal conductivity of 5 to 6 BTU•in/(ft²•hr•°F) [0.72-0.87 W/(m•K)] at 75°F. Service operating temperature range is -100°F to +350°F. Comes in syringes and standard containers ranging from ½ pints to gallons.

Master Bond, masterbond.com/industries/underfill-encapsulants

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