DEK Nano Ultra Stencil  is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.

ASM Assembly Systems/DEK, www.dek.com

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