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Sarcon GAR glass fabric-reinforced thermal interface material delivers thermal conductivity of 3W/m°K, while exhibiting a thermal resistance as low as 0.17°Cin2/W. Is for complex die-cut shapes and exerts a low force on components, as it fills air gaps between the heatsink and board-level heat sources. Comes in three thicknesses: 0.2, 0.3, and 0.45mm; is offered in rolls, pre-cut sheets or can be die-cut.  V‐0 equivalent thin film is recommended for applications with operational temperatures from ‐40°C to +150°C.

Fujipoly America Corp., www.fujipoly.com 

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