SMTAI Opens Registration, Finalizes Program
ROSEMONT, IL – The SMTA has finalized the program for SMTA International and opened registration.
The conference will be held here Sept. 27 to Oct. 1.
This year's program includes 19 courses, 120 technical papers, and three symposia. The conference includes technical tracks covering advanced packaging technology, evolving technologies, Lean initiatives, flux, solder, adhesives, harsh environment applications, inspection technologies, lead-free soldering technology, manufacturing excellence, and substrates/PCB technology. Symposia include the Evolving Technologies Summit, Harsh Environments Symposium, and Lead-Free Soldering Technology Symposium. A tutorial on LED, BGA, and QFN Assembly and Inspection is free for SMTA and IPC members who register in advance.
Over 160 suppliers will display equipment, materials, and services at the two-day exhibition.
For more information visit www.smta.org/smtai or contact JoAnn Stromberg at joann@smta.org.
