Emil Otto's EO-FP-003 is a ROL0 flux paste developed for repair work on printed circuit boards and for applications according to IPC/IPC 610.

Transition Automation's Squeegee Buddy is a new tool for SMT printer users to help improve process quality and organization.

Shenmao's PF734-S is a low-temperature BGA solder sphere designed for low-temperature ball attachment processes.

Metcal's BVX-250 Fume Extraction System is a two-port portable fume extractor that offers HEPA filtration and several innovations for changing the filter, exhausting the air, and communicating with the operator.

Emil Otto's EO-G-005 and EO-G-007 are an expansion of its product range of ecologically degradable fluxes.

Stackpole’s RNCV resistors utilize thin film technology to achieve high voltage ratings, high stability, and excellent precision not achievable by thick film high voltage chip resistors.

Vitronics Soltec's ZEVAm+ selective soldering machine has been redesigned to accommodate board sizes up to 510mm x 510mm (20in. x 20in.).

Krylex's Kura-Low electronics adhesive enables high performance bonding performance at thermal cure temperatures as low as 60◦C, all while being supplied in a highly RT stabilised, one-part, pre-mixed formula.

MRSI Systems' MRSI-705HF high force die bonder is a new variant of the MRSI-705 platform.

Stackpole’s RNCP thin film chip resistor series now features 1210, 2010, and 2512 sizes.

Astronics' ATS-AutoPoint Multi-Axis Robotic System (APMARS) and ATS-AutoPoint Desktop (APDT) automatically diagnose circuit board assembly and component malfunctions.

Rohm's BD5310xG-CZ/BD5410xG-CZ series of Hall ICs are designed for automotive applications requiring magnetic detection.