Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.

Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.

Identco's VortexID is a wire label system that can place up to 20 labels per minute and operate 24/7.

TRI's TR7600 SV Series 3-D AXI outperforms its predecessor, the TR7600 Series, by a 20% increase in performance.

Bowman's K Series benchtop XRF features an expansive measurement area, selectable spot sizes, and high levels of both precision and speed.

Count On Tools' Custom Fuji NXT H02 nozzle is designed specifically for the placement of Panasonic AYC2F automotive board-to-board connectors.

Vitrox's AUX 4S+ Inspection Module is an add-on feature for the TH3000i and TR3000i inspection handlers.

ULT's LRA 400.1 soldering fume extractor is a modular and quiet fume extractor that can be used in manual and automated soldering processes.

Pleora Technologies' Vaira manufacturing solution now includes a scalable suite of shop-floor ready AI and digitization apps help manufacturers automate and upgrade error-prone processes.

Transition Automation's Soft-Touch Paste Retainer system now features dual pin locking that better secures the white dam portion.

Master Bond EP21LVFL is a two-part epoxy said to combine good flexibility with a solid strength profile.