SMTAI Adds 3 Tech Tracks
ROSEMONT, IL – SMTAI now includes three additional tracks: Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.
The Advanced Packaging Technology track will tackle issues such as 2.5D packaging, embedded power electronics, and warpage. The Manufacturing Excellence track includes research on cleaning, conformal coating, as well as recent developments from the HDPUG Consortium. The Inspection Technologies track includes a session on counterfeit component mitigation, in addition to solder paste volume measurement, high-volume manufacturing, conformal coating, and supply chain issues.
The Lead-Free Symposium opens with recent findings from the AREA Consortium. The other sessions in the track cover screen Printing, reliability and performance of lead-free interconnections, and innovation for high-reliability electronics.
SMTAI will take place Sept. 17-21. For more information, visit https://www.smta.org/smtai/.
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