TR7007 SII Ultra 3-D high-speed solder paste inspection performs at speed up to 180 cm2/sec.

Inspects low solder bridges and compensates board warpage for eliminating local PCB deformation. Eases data exchange between production line and MES to enable data traceability for connected factory. Uses YMS 4.0 Industry 4.0 data-driven management system.

TRI TR7007 SII Ultra 20210503

Test Research Inc.
tri.com.tw/en/index.html

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